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Dry Etch Equipment Summary

The tables in these sections are all of the etchers that are available in the SNF labs, sorted by etcher type. If you would like to learn about different types of dry etchers and how to chose your etcher, please visit the online dry etching course.

If you would like to see a summary of etchers for a specific material (i.e. SiO2 or poly silicon) please visit the materials page.

Dry Etch Equipment Summary

Etcher Type: Inductively Coupled Plasma Etching (ICP)
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
Oxford III-V etcher (Ox-35) Inductively Coupled Plasma Etching (ICP) Flexible
1

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers;...

Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL)
Inductively Coupled Plasma Etching (ICP) Flexible
1

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to...

STS Deep RIE Etcher (stsetch)
Inductively Coupled Plasma Etching (ICP) Clean, Semiclean
1

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder...

Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Inductively Coupled Plasma Etching (ICP) Flexible
1

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config;...

Lam Research TCP 9400 Poly Etcher (lampoly) Inductively Coupled Plasma Etching (ICP) Clean, Semiclean
25

Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching...

Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox) Inductively Coupled Plasma Etching (ICP) Flexible
1

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to...

Etcher Type: Reactive Ion Etching (RIE)
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
MRC Reactive Ion Etcher (mrc) Reactive Ion Etching (RIE) Flexible 1

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be...

Oxford Dielectric Etcher (oxford-rie)
Reactive Ion Etching (RIE) Flexible
1

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Etcher Type: Plasma Mode Etching
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
Drytek 100 Plasma Etcher (drytek2) Plasma Mode Etching All 6

Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly...

Samco PC300 Plasma Etch System (samco) Plasma Mode Etching Flexible Four 4" wafers or two 6" wafers and one 8" wafer
Etcher Type: Downstream/Remote Plasma Resist Removal
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
Gasonics Aura Asher (gasonics)
Downstream/Remote Plasma Resist Removal Clean, Semiclean
25

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for...

Matrix Plasma Resist Strip (matrix)
Downstream/Remote Plasma Resist Removal Flexible
25

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for...

Etcher Type: Vapor Etching
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
Xactix Xenon Difluoride Etcher (xactix)
Vapor Etching All 1

Isotropic Si etching; can be used for backside Si removal on small pieces

SPTS uetch vapor etch (uetch)
Vapor Etching All 1

Pieces need a carrier wafer; Isotropic Etching

Etcher Type: Magnetically Enhanced RIE (MERIE)
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
AMAT P5000 Etcher (p5000etch) Magnetically Enhanced RIE (MERIE) Clean, Clean (Ge), Semiclean
Etcher Type: Dry Resist Removal
Equipment name Primary Materials Etched Gases Other Materials Etched Etcher Type Cleanliness Substrate Size Maximum Load Notes
Technics Asher (technics)
Dry Resist Removal Flexible Four 4" wafers to pieces, one 6" or 8" wafer
Last modified: 4 May 2022