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Metallization Equipment Summary

This is a summary of the metallization equipment, grouped by deposition types: Evaporation and Sputtering.

Metallization Equipment Summary

Evaporation
Equipment Cleanliness Materials Lab Supplied Materials User Supplied Material Thickness Range Substrate Size Maximum Load Notes Location
AJA2 Evaporator (aja2-evap) Semiclean
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

SNF Cleanroom Paul G Allen L107
Intlvac Evaporator (Intlvac_evap) Clean, Semiclean
0.00 - 0.50 μm
12 4 inch wafers, 2 6 inch wafers SNF Cleanroom Paul G Allen L107
AJA Evaporator (aja-evap) Flexible
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

SNF Exfab Paul G Allen 155A Venice
Sputtering
Equipment Cleanliness Materials Lab Supplied Materials User Supplied Material Thickness Range Substrate Size Maximum Load Notes Location
Lesker2 Sputter (lesker2-sputter) Semiclean
1.00 μm
one 4 inch wafer, one 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

SNF Cleanroom Paul G Allen L107
Lesker Sputter (lesker-sputter) Flexible
1 4 inch wafer, 1 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

SNF Exfab Paul G Allen 155A Venice
Last modified: 30 Jan 2023