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Metallization Equipment Summary

This is a summary of the metallization equipment, grouped by deposition types: Evaporation and Sputtering.

Metallization Equipment Summary

Evaporation
Equipment Cleanliness Materials Lab Supplied Materials User Supplied Material Thickness Range Substrate Size Maximum Load Notes Location
Innotec Evaporator (Innotec) Flexible
22 four inch wafers

Precious metals limit is <200nm

SNF Cleanroom Paul G Allen L107
Intlvac Evaporation (Intlvac_evap) Clean, Semiclean
0.00 - 0.50 μm
12 4 inch wafers, 2 6 inch wafers SNF Cleanroom Paul G Allen L107
AJA2 Evaporator (aja2-evap) Semiclean
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

SNF Cleanroom Paul G Allen L107
AJA Evaporator (aja-evap) Flexible
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

SNF Exfab Paul G Allen 155A Venice
Sputtering
Equipment Cleanliness Materials Lab Supplied Materials User Supplied Material Thickness Range Substrate Size Maximum Load Notes Location
Lesker2 Sputter (lesker2-sputter) Semiclean
1.00 μm
one 4 inch wafer, one 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

SNF Cleanroom Paul G Allen L107
Lesker Sputter (lesker-sputter) Flexible
1 4 inch wafer, 1 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

SNF Exfab Paul G Allen 155A Venice
Last modified: 30 Jan 2023