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Metallization Equipment Summary

This is a summary of the metallization tools in SNF, grouped by deposition type.

If you would like to see a summary of metallization equipment grouped by material deposited, please visit the materials page.

Metallization Equipment Summary

Evaporation
Equipment Location (for Equipment) Cleanliness Substrate Size Maximum Load Material Thickness Range Materials Lab Supplied Materials User Supplied Notes
Innotec Evaporator (Innotec) SNF Cleanroom Paul G Allen L107 Flexible 22 four inch wafers

Precious metals limit is <200nm

Intlvac Evaporation (Intlvac_evap) SNF Cleanroom Paul G Allen L107 Clean, Semiclean 12 4 inch wafers, 2 6 inch wafers
0 - 1 μm
AJA2 Evaporator (aja2-evap) SNF Cleanroom Paul G Allen L107 Semiclean 4"x3 or 6"x1 wafers or pieces
0 - 300 nm

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

AJA Evaporator (aja-evap) SNF Exfab Paul G Allen 155A Venice Flexible 4"x3 or 6"x1 wafers or pieces
0 - 300 nm

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in...

Sputtering
Equipment Location (for Equipment) Cleanliness Substrate Size Maximum Load Material Thickness Range Materials Lab Supplied Materials User Supplied Notes
Lesker2 Sputter (lesker2-sputter) SNF Cleanroom Paul G Allen L107 Semiclean one 4 inch wafer, one 6 inch wafer
1 μm

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker Sputter (lesker-sputter) SNF Exfab Paul G Allen 155A Venice Flexible 1 4 inch wafer, 1 6 inch wafer

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Last modified: 4 May 2022