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Metallization Equipment Summary
This is a summary of the metallization equipment, grouped by deposition types: Evaporation and Sputtering.
Metallization Equipment Summary
| Equipment | Cleanliness | Materials Lab Supplied | Materials User Supplied | Material Thickness Range | Substrate Size | Maximum Load | Notes | Location |
|---|---|---|---|---|---|---|---|---|
| Innotec Evaporator (Innotec) | Flexible |
|
22 four inch wafers |
Precious metals limit is <200nm |
SNF Cleanroom Paul G Allen L107 | |||
| Intlvac Evaporation (Intlvac_evap) | Clean, Semiclean |
0 -
1 μm
|
12 4 inch wafers, 2 6 inch wafers | SNF Cleanroom Paul G Allen L107 | ||||
| AJA2 Evaporator (aja2-evap) | Semiclean |
0 -
300 nm
|
4"x3 or 6"x1 wafers or pieces |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in... |
SNF Cleanroom Paul G Allen L107 | |||
| AJA Evaporator (aja-evap) | Flexible |
0 -
300 nm
|
4"x3 or 6"x1 wafers or pieces |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in... |
SNF Exfab Paul G Allen 155A Venice |
| Equipment | Cleanliness | Materials Lab Supplied | Materials User Supplied | Material Thickness Range | Substrate Size | Maximum Load | Notes | Location |
|---|---|---|---|---|---|---|---|---|
| Lesker2 Sputter (lesker2-sputter) | Semiclean |
1 μm
|
one 4 inch wafer, one 6 inch wafer |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
SNF Cleanroom Paul G Allen L107 | |||
| Lesker Sputter (lesker-sputter) | Flexible |
|
1 4 inch wafer, 1 6 inch wafer |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
SNF Exfab Paul G Allen 155A Venice |
Last modified: 30 Jan 2023
