SUNetID Login
Metallization Equipment Summary
This is a summary of the metallization tools in SNF, grouped by deposition type.
If you would like to see a summary of metallization equipment grouped by material deposited, please visit the materials page.
Metallization Equipment Summary
| Equipment | Location (for Equipment) | Cleanliness | Substrate Size | Maximum Load | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Notes |
|---|---|---|---|---|---|---|---|---|
| Innotec Evaporator (Innotec) | SNF Cleanroom Paul G Allen L107 | Flexible | 22 four inch wafers |
|
Precious metals limit is <200nm |
|||
| Intlvac Evaporation (Intlvac_evap) | SNF Cleanroom Paul G Allen L107 | Clean, Semiclean | 12 4 inch wafers, 2 6 inch wafers |
0 -
1 μm
|
||||
| AJA2 Evaporator (aja2-evap) | SNF Cleanroom Paul G Allen L107 | Semiclean | 4"x3 or 6"x1 wafers or pieces |
0 -
300 nm
|
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in... |
|||
| AJA Evaporator (aja-evap) | SNF Exfab Paul G Allen 155A Venice | Flexible | 4"x3 or 6"x1 wafers or pieces |
0 -
300 nm
|
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in... |
| Equipment | Location (for Equipment) | Cleanliness | Substrate Size | Maximum Load | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Notes |
|---|---|---|---|---|---|---|---|---|
| Lesker2 Sputter (lesker2-sputter) | SNF Cleanroom Paul G Allen L107 | Semiclean | one 4 inch wafer, one 6 inch wafer |
1 μm
|
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
|||
| Lesker Sputter (lesker-sputter) | SNF Exfab Paul G Allen 155A Venice | Flexible | 1 4 inch wafer, 1 6 inch wafer |
|
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Printer-friendly version Last modified: 4 May 2022
