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Wet Bench Equipment Summary

Wet Bench Equipment

Processing Techniques Equipment name (badger id) Chemicals Primary Materials Etched Substrate Size Cleanliness Notes
Silicon Nitride Wet Etching Wet Bench Clean_res- hotphos (wbclean_res-hotphos) 85% Phosphoric Acid Silicon Nitride
Clean

Resist should have been removed

Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching Wet Bench Flexcorr 1 (wbflexcorr-1) Acids, 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 85% Phosphoric Acid, 9:1 Piranha Solution, 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2, Aluminum Etchant, Chromium Etchant, Gold Etchant, Bases, Potassium Hydroxide 45% Aluminum, Chromium, Gold, Photoresist, Silicon, Silicon Dioxide, Silicon Monoxide Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Pre-Diffusion Clean: Germanium Wet Bench Germanium (wbgen2) 50:1 Hydrofluoric Acid
Clean (Ge)

Clean Germanium wafers only: Pre-Diffusion Clean

Acid or Base Wet Etching, Piranha Cleaning Wet Bench Flexcorr 2 (wbflexcorr-2) Acids, Bases Flexible

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Aluminum and Titanium and Tungsten Wet Etching Wet Bench CMOS Metal (wbclean3) (wbclean3) 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid, Aluminum Etchant, Titanium (Ti) etchant Peroxide-based, Tungsten (W) etchant Peroxide-based Aluminum, Titanium, Tungsten
Semiclean

Al, Ti, or W wet etching or oxide etching

Resist Develop (manual) Wet Bench Miscellaneous (wbmiscres) Developers Flexible

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Mask Cleaning (manual) Mask Scrubber (masksrub) DI Water All

5 inch mask cleaning, water under pressure, no chemicals

Wet Resist Removal Wet Bench Resist Strip (wbresstrip-1) PRS-1000, SRS-100 Photoresist Clean (Ge), Semiclean, Flexible

Wet Resist Removal: SRS-100 or PRS1000

Silicon Oxide Wet Etching Wet Bench Clean_res-hf (wbclean_res-hf) 20:1 Buffered oxide etch, 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid Silicon Monoxide
Clean

Resist as mask allowed

Acid or Base Wet Etching, Piranha Cleaning Wet Bench Flexcorr 4 (wbflexcorr-4) Acids, Bases Flexible

Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.

Solvent Cleaning, Wet Resist Removal Wet Bench Flexible Solvents 1 (wbflexsolv-1) Solvents Flexible

Manual solvent cleaning, two ultrasonic baths.

Solvent Cleaning, Wet Resist Removal Wet Bench Flexible Solvents 2 (wbflexsolv-2) Solvents Flexible

Manual solvent cleaning, hot plate

Decontamination Wet Bench Decontamination (wbdecon) Standard Clean 2
Clean

KOH or wafersaw or post-cmp decontamination

Solvent Cleaning Lithography Solvent Bench (lithosolv) Solvents Flexible

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Piranha Cleaning, Wet Resist Removal Wet Bench Clean_res-piranha (wbclean_res-piranha) 9:1 Piranha Solution
Clean

Resist will be removed

Acid or Base Wet Etching, Piranha Cleaning Wet Bench Flexcorr 3 (wbflexcorr-3) Acids, Bases Flexible

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Solvent Cleaning, Wet Resist Removal, Metal Lift-off Wet Bench Flexible Solvents (wbflexsolv) Solvents Flexible

Manual solvent cleaning of substrates or resist removal.

CO2 Drying Critical Point Dryer (cpd) CO2 (liquid) Flexible

CO2 drying after release of micromachined devices

Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean Wet Bench Clean 1 (wbclean-1) 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2
Clean

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Resist Develop (manual) Ebeam Process Wet Bench (wbebres) Solvents Flexible

Manual developing of Ebeam resist

Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean Wet Bench Clean 2 (wbclean-2) 6:1 Buffered oxide etch, 50:1 Hydrofluoric Acid, Standard Clean 1, Standard Clean 2
Clean

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Solvent Cleaning, Metal Lift-off Ex Fab Solvent Wet Bench (wbexfab_solv) Solvents Flexible
Last modified: 30 Apr 2020