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Helium

Chemical Formula:

He

Gases Equipment Tabs

Etch Equipment Table

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched	Gases
AMAT P5000 Etcher p5000etch	Clean Clean (Ge) Semiclean	SNF Cleanroom Paul G Allen L107	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten	80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
Lam Research TCP 9400 Poly Etcher lampoly	Clean Semiclean	SNF Cleanroom Paul G Allen L107	Si Poly Silicon	Ge SiGe	80% He/ 20%O₂ C₂F₆ CF₄ Cl₂ HBr He N₂ O₂
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox	Flexible	SNF Cleanroom Paul G Allen L107	C SiC SiN SiO₂	Si based materials Various C-based	Ar C₄F₈ CF₄ CHF₃ H₂ He N₂ O₂

Anneal/Oxidation Equipment Table

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
PlasmaTherm Shuttlelock PECVD System ccp-dep	All	SNF Cleanroom Paul G Allen L107	100 Å - 4 μm