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8 inch wafer

Short Name:

8"

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
DISCO Wafer Saw DISCO wafersaw	DISCO wafersaw training	Flexible	SNF	SNF Exfab Paul G Allen 159 Capitola
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Fiji 1 fiji1	Fiji 1 and 2 Training	Semiclean	SNF	SNF Cleanroom Paul G Allen L107
Fiji 2 fiji2	Fiji 1 and 2 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Fiji 3 fiji3	Fiji 3 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Restricted to non-conductive films only
Flexus 2320 Stress Tester stresstest	Flexus 2320 Stress Tester Training	All	SNF	SNF Cleanroom Paul G Allen L107
LEI1500 Contactless Sheet Resistance Mapping eddycurrent	LEI1500 Contactless Sheet Resistance Mapping Training	All	SNF	SNF Exfab Paul G Allen 151 Ocean
MFS Large Evaporator MFS Large	MFS Large Training		SNSF		Angled deposition Spilker Engineering:SNSF membership required
MVD mvd	MVD Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Reactor located inside glovebox
Oxford PlasmaPro 80 - Reactive Ion etcher RIE: Oxford PlasmaPro 80 (at SNSF)	Oxford PlasmaPro 80 - Reactive Ion etcher Training		SNSF		No carrier wafer needed; multiple pieces can be processed together Location: SNSF; Spilker Building - Nanopatterning cleanroom
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater	Parylene Coater Training	Flexible	SNF	SNF Exfab Paul G Allen 155 Mavericks
Prometrix Resistivity Mapping System prometrix	Prometrix Training	All	SNF	SNF Cleanroom Paul G Allen L107	3 Probe Heads for different Cleanliness
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Savannah savannah	Savannah Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Sensofar S-neox s-neox	Sensofar S-neox Training	All	SNF	SNF Cleanroom Paul G Allen L107	non contact 3D optical profiling
SPTS uetch vapor etch uetch	SPTS uetch vapor etch Training	All	SNF	SNF Cleanroom Paul G Allen L107	Pieces need a carrier wafer; Isotropic Etching
STS Plasma Enhanced CVD sts	STS Plasma Enhanced CVD Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Technics Asher technics	Technics Asher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Tencor P2 Profilometer p2	Tencor P2 Profilometer Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	Step height measurement range 500 Å to 80 µm

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Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Minimum Resolution	Objective Separation	Process Temperature Range	Gases	Sample Size Limits	Resolution Notes	Substrate Size	Substrate Type	Maximum Load
DISCO Wafer Saw DISCO wafersaw	Machining > Wafer Saw	Flexible											Pieces 2" 3" 4" 6" 8"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1x4", 1x6" or 1x8" wafer, or pieces
Ex Fab Develop Wet Bench wbexfab_dev	Optical Photolithography > Resist Develop	Flexible											Pieces 2" 3" 4" 6" 8" 12" Other
Ex Fab Solvent Wet Bench wbexfab_solv	Patterning > Metal Lift-off Cleaning > Solvent Cleaning	Flexible											Pieces 2" 3" 4" 6" 8" Other
Fiji 1 fiji1	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD	Semiclean			1 Å - 50 nm	Metal oxides HfN Pt Ru SiO₂ Ta₂O₅ TaN TiN Various Dielectrics Alumina Hafnia Titania Zirconia			24 °C - 350 °C	Ar H₂ N₂ NH₃ O₂			Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2)
Fiji 2 fiji2	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD	Flexible			1 Å - 50 nm	Metal oxides Ga₂O₃ HfN In₂O₃ Ni_xO_y Pt Ru SiN SiO₂ SnO₂ SrO Ta₂O₅ TiN Various Dielectrics Alumina Hafnia ITO Moly Oxide Titania Zirconia			24 °C - 350 °C	Ar H₂ N₂ O₂			Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (Various) , (Various) , (LiNb) , (Various)
Fiji 3 fiji3	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD	Flexible			1 Å - 50 nm	SiO₂ Various Dielectrics Alumina Hafnia Titania			24 °C - 350 °C	Ar H₂ N₂ NH₃ O₂			Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (III-V)
Flexus 2320 Stress Tester stresstest	Characterization > Film Stress Measurement	All											3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
LEI1500 Contactless Sheet Resistance Mapping eddycurrent	Characterization > Sheet Resistance Measurement	All									8 in wafer	Sensor Transducer Size is 14 mm diameter	2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various)	1 wafer(2" to 8")
MFS Large Evaporator MFS Large	Deposition > Physical Vapor Deposition (PVD) > Evaporation					Ag Al Au Cr Cu Fe Ge Ir MgF Nb Ni Pd SiO Ta Ti W Moly							Pieces 2" 3" 4" 6" 8" 12"
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1 Å - 50 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS			24 °C - 150 °C	Ar			Pieces 2" 3" 4" 6" 8"
Oxford PlasmaPro 80 - Reactive Ion etcher RIE: Oxford PlasmaPro 80 (at SNSF)	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)		Si SiN SiO₂	C Ti TiN W PI						Ar CF₄ CHF₃ O₂ SF₆			Pieces 2" 3" 4" 6" 8"		1
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater	Deposition	Flexible				poly(p-xylylene)							Pieces 2" 3" 4" 6" 8" Cones Disks Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)
Prometrix Resistivity Mapping System prometrix	Characterization > Sheet Resistance Measurement	All											2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Samco PC300 Plasma Etch System samco	Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Plasma Mode Etching Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist	Si based materials dimethylpolysiloxane Si SiN SiO₂ SiON Various polymers PI Poly Silicon					20 ºC	CF₄ O₂ SF₆			Pieces 2" 3" 4" 6" 8" Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)	Four 4" wafers or two 6" wafers and one 8" wafer
Savannah savannah	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1 Å - 50 nm	Metal oxides Ga₂O₃ SnO₂ Various Dielectrics ZnO₃ Alumina AZO Hafnia Titania Zirconia			24 °C - 250 °C	N₂			Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (Various) , (Various) , (LiNb) , (Various)
Sensofar S-neox s-neox	Characterization > Surface Analysis > Profilometer > Optical Profilometer	All											Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
SPTS uetch vapor etch uetch	Etching > Vapor Etching	All	SiO₂							C₂H₅OH HF vapor			Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1
STS Plasma Enhanced CVD sts	Deposition > Chemical Vapor Deposition (CVD) > Plasma Enhanced (PE) CVD > Deposited Nitride (PECVD) Deposition > Chemical Vapor Deposition (CVD) > Plasma Enhanced (PE) CVD > Deposited Oxide (PECVD)	Flexible			100 Å - 5 μm				350 ºC	2% SiH₄ in N₂ N₂ NH₃ O₂			Pieces 4" 6" 8"		Four 4 inch or one 6 inch or one 8 inch
Technics Asher technics	Etching > Dry Etching Cleaning > Resist Removal > Dry Resist Removal	Flexible	Resist	dimethylpolysiloxane poly(p-xylylene) PI						O₂			Pieces 4" 6" 8"	(Si) , (SiO2) , (SiO₂)	Four 4" wafers to pieces, one 6" or 8" wafer
Tencor P2 Profilometer p2	Characterization > Surface Analysis > Profilometer > Step Profile	Clean, Semiclean											Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (GaAs) , (GaN) , (Ge) , (SiO₂) , (III-V) , (Al₂O₃)	1

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