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Matrix Plasma Resist Strip (matrix)

Overview

photo of matrix in SNF cleanroom

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).

Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
25
Notes: 

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

Lab Organization, Location, and Badger Information

Badger Area: 
SNF: Dry Etching
Badger ID: 
matrix

Training and Maintenance

photo of matrix asher in SNF cleanroom
Lab Facility: 
Training Charges: 
0.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  3. Contact the primary trainer: . Submit the shadowing form to get qualified.