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Xactix Xenon Difluoride Etcher (xactix)

Overview

The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.  XeF2 is a vapor phase etch, which exhibits nearly very high selectivity of silicon to photo-resist, silicon dioxide, silicon nitride and aluminum.   The e-1 Series can be used to etch silicon wafers, up to 6” in diameter, wafer pieces, die, or other structure into the etch chamber.  Details of the process sequence are controlled and captured by the control software. The etch progress can be monitored through the transparent chamber lid.

Cleanliness: 

Processing Technique(s)

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
1
Notes: 

Isotropic Si etching; can be used for backside Si removal on small pieces

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
0.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Sign up for the relevant training scheduled in .
  4. Contact the primary trainer: .

Operating Instructions