SNF is open under New Normal Rules. ANY shadowing must be coordinated with SNF staff first.
Oxidation and Annealing Equipment Summary
Oxidation and Annealing Equipment Summary
| Cleanliness | Gases | Cleaning Required | Substrate Size | Maximum Load | Process Temperature Range | Material Thickness Range | Notes | |
|---|---|---|---|---|---|---|---|---|
| Thermco1 (thermco1) | Clean | Pre-Diffusion Clean | 50 |
700 °C - 1100 °C
|
25 Å -
2 μm
|
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
||
| Thermco3 (thermco 3) | Clean | Pre-Diffusion Clean | 50 |
700 °C - 1100 °C
|
25 Å -
2 μm
|
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
||
| Thermco4 (thermco4) | Flexible | 50 |
700 °C - 1100 °C
|
25 Å -
2 μm
|
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
| Cleanliness | Gases | Cleaning Required | Substrate Size | Maximum Load | Process Temperature Range | Material Thickness Range | Notes | |
|---|---|---|---|---|---|---|---|---|
| Tylanfga (tylanfga) | Semiclean | Standard Metal Clean | 50 |
250 °C - 800 °C
|
100 Å -
100 Å
|
For standard metals deposited in Lesker2, Intlvac Sputter or Intlvac Evaporation only. N2 and Ar... |
| Cleanliness | Gases | Cleaning Required | Substrate Size | Maximum Load | Process Temperature Range | Material Thickness Range | |
|---|---|---|---|---|---|---|---|
| Thermolyne (thermolyne) | Flexible | 25 |
25 °C - 1000 °C
|
|
| Cleanliness | Gases | Cleaning Required | Substrate Size | Maximum Load | Process Temperature Range | Material Thickness Range | |
|---|---|---|---|---|---|---|---|
| Aw610_r (aw610_r) | Flexible |
21 °C - 1150 °C
|
|
||||
| Aw610_l (aw610_l) | Clean | Pre-Diffusion Clean | 1 wafer |
21 °C - 1150 °C
|
|
Printer-friendly version Last modified: 30 Apr 2020
