Oxford Dielectric Etcher (oxford-rie)
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and oxygen.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Lab Organization, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check Training Calendar for any scheduled training.
Read the relevant operating procedures before the training session.
Optional: For background on Plasma Etching, Goto Lagunita site: Online Course
for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login
to log in directly to the course. to log in directly to the course. Go to the Dry Etching Section for the three videos on plasma etching principles and go to the "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Attend the training session to get qualified.