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Oxford Dielectric Etcher (oxford-rie)


photo of oxrie etcher in SNF Cleanroom
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and oxygen.

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Lab Organization, Location, and Badger Information

Badger Area: 
SNF: Dry Etching
Badger ID: 

Training and Maintenance

photo of oxrie in SNF Cleanroom
Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check Training Calendar for any scheduled training.
  2. Contact the primary trainer: .
  3. Read the relevant operating procedures before the training session.
  4. Attend the training session to get qualified.

Operating Instructions