Oxford Dielectric Etcher (oxford-rie)
Overview
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and oxygen.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Type
Substrate Sizes
Maximum Load:
1
Notes:
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Lab Organization, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
SNF: Dry Etching
Badger ID:
oxford-rie
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Check Training Calendar for any scheduled training.
- Contact the primary trainer: .
- Read the relevant operating procedures before the training session.
- Optional: For background on Plasma Etching, Goto Lagunita site: Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course. Go to the Dry Etching Section for the three videos on plasma etching principles and go to the "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - Attend the training session to get qualified.
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