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Oxford III-V etcher (Ox-35)

Overview

photo of ox35 in SNF Cleanroom

The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed for etching III-V semiconductors. The Oxford III-V Etcher is currently approved to etch GaAs, InGaAs, InAs, InP, InGaAsP, and GaP only.

Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
1
Notes: 

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check Training Calendar for any scheduled training.
  2. Contact the primary trainer: .
  3. Read the relevant operating procedures before your training session.
  4. Attend the training session to get qualified.

Operating Instructions

Operating Instructions