SNF is open under New Normal Rules. ANY shadowing must be coordinated with SNF staff first.
MRC Reactive Ion Etcher (mrc)
Overview
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Sizes
Maximum Load:
1
Notes:
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Lab Facility, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
Badger ID:
mrc
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Check the training calendar for any scheduled training: .
- Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
- Read the relevant operating procedures:
- Online training is optional. See Online training required. Open Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course.Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - You can also shadow and experienced user and submit the completed shadowing form to get qualified.
- Get qualified by either attending the training or submitting the shadowing form.
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