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MRC Reactive Ion Etcher (mrc)

Overview

photo of mrc etcher in SNF cleanroom
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 
1
Notes: 

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Check the training calendar for any scheduled training: .
  2. Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
  3. Read the relevant operating procedures:
  4. Get qualified by either attending the training or submitting the shadowing form.

Operating Instructions