The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Online training is optional. Online Course for general information about the online training. Go to Online Nano Course Login to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
You can also shadow an experienced user and submit the completed shadowing form to get qualified.
Get qualified by either attending the training or submitting the shadowing form.