MRC Reactive Ion Etcher (mrc)
Overview
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Sizes
Maximum Load:
1
Notes:
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Lab Organization, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
SNF: Dry Etching
Badger ID:
mrc
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Online training is optional. Online Course for general information about the online training. Go to Online Nano Course Login to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
- You can also shadow an experienced user and submit the completed shadowing form to get qualified.
- Get qualified by either attending the training or submitting the shadowing form.
- Contact the primary trainer: .
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