MRC Reactive Ion Etcher (mrc)
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including oxides, nitrides, silicons, and some organic films. This system accommodates the most etch processing needs for non-CMOS compatible materials. It is a manual system which can accommodate wafer pieces and wafers up to 6".
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check the training calendar for any scheduled training:
Read the relevant operating procedures:
Online training is optional. See Online training required. Open Online Course
for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login
to log in directly to the course. to log in directly to the course.Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
You can also shadow and experienced user and submit the completed shadowing form to get qualified.
Get qualified by either attending the training or submitting the shadowing form.