The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Flexible" category.
Equipment name & Badger ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Objective Separation | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AFM-Asylum afm-asylum |
Flexible |
|
|
|
|
||||||||
Aix200 aix200 |
Pre-Diffusion Clean, Special: See Notes | Flexible |
0 -
5 μm
|
|
|
300 °C - 800 °C
|
, , , |
4"x1 wafer or 2"x1 wafer or 4 pieces | |||||
Aixtron Black Magic graphene CVD furnace aixtron-graphene |
Flexible |
|
|
|
800 °C - 1100 °C
|
, |
1x4" wafer or Copper/Nickel foil | ||||||
AJA Evaporator aja-evap |
Flexible |
0 -
300 nm
|
|
|
|
, , , , , , , , , , , |
4"x3 or 6"x1 wafers or pieces | ||||||
Alphastep 500 Profilometer alphastep |
Flexible |
|
|
|
|
, , , , , , , , |
1 | ||||||
Alveole Primo alveole |
Flexible |
|
|
|
|
||||||||
Aw610_r aw610_r |
Flexible |
|
|
|
21 °C - 1150 °C
|
, , |
|||||||
Biologic SP-300 biologic |
Flexible |
|
|
|
|
||||||||
Blue M Oven bluem |
Flexible |
|
|
|
0 °C - 430 °C
|
, , , , , , , , , |
|||||||
Critical Point Dryer cpd |
Flexible |
|
|
|
|
, , , , , , , , , |
|||||||
CytoViva HSI cytoviva |
Flexible |
|
|
|
|
||||||||
DISCO Backgrinder disco-backgrind |
Flexible |
|
|
|
|
||||||||
DISCO Wafer Saw DISCO wafersaw |
Flexible |
|
|
|
|
, , , , , , , , |
1x4", 1x6" or 1x8" wafer, or pieces | ||||||
Epilog Fusion M2 Laser Cutter lasercutter |
Flexible |
|
|
|
|
||||||||
EV Group Wafer Bonder evbond |
Flexible |
|
|
|
|
, , , , , |
|||||||
Ex Fab Develop Wet Bench wbexfab_dev |
Flexible |
|
|
|
|
||||||||
Ex Fab Solvent Wet Bench wbexfab_solv |
Flexible |
|
|
|
|
||||||||
Fiji 2 fiji2 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , , , , , , , , , , , |
|||||||
Fiji 3 fiji3 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , |
|||||||
Finetech Lambda flipchipbonder |
Flexible |
|
|
|
°C - 400 °C
|
, , , , , |
1 |