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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
AFM-Asylum afm-asylum	AFM-Asylum Training	Flexible	SNF	SNF Exfab Paul G Allen 151 Ocean
Aix200 aix200	Aixtron MOCVD - III-V system training	Flexible	SNF	SNF MOCVD Paul G Allen 213XA	N and P doping available. For Si clean: SC1, SC2, HF dip. For III-V clean: HCl or HF dip.
Aixtron Black Magic graphene CVD furnace aixtron-graphene	Aixtron Black Magic graphene CVD furnace training	Flexible	SNF	SNF Exfab Paul G Allen L119 Año Nuevo
AJA Evaporator aja-evap	AJA Evaporation training	Flexible	SNF	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Alphastep 500 Profilometer alphastep	Alphastep 500 Profilometer Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson	500Å to 300µm
Alveole Primo alveole	Alveole Primo Training	Flexible	SNF	SNF Exfab Paul G Allen 151 Ocean
Aw610_r aw610_r	AllWin 610 RTA Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Biologic SP-300 biologic	BioLogic Potentiostat Training	Flexible	SNF Exfab	SNF Exfab Paul G Allen 155 Mavericks
Blue M Oven bluem	Blue M Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Convection in N2. Cure. Programmable.
Critical Point Dryer cpd	Critical Point Dryer Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	CO2 drying after release of micromachined devices
CytoViva HSI cytoviva	Cytoviva Training	Flexible	SNF	SNF Exfab Paul G Allen 151 Ocean
DISCO Backgrinder disco-backgrind	DISCO Backgrinder Training	Flexible	SNF	SNF Exfab Paul G Allen 159 Capitola
DISCO Wafer Saw DISCO wafersaw	DISCO wafersaw training	Flexible	SNF	SNF Exfab Paul G Allen 159 Capitola
Epilog Fusion M2 Laser Cutter lasercutter	Lasercutter Training	Flexible	SNF	SNF Exfab Paul G Allen 155A Venice
EV Group Wafer Bonder evbond	EV Group Wafer Bonder Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Fiji 2 fiji2	Fiji 1 and 2 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Fiji 3 fiji3	Fiji 3 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Restricted to non-conductive films only
Finetech Lambda flipchipbonder	Flip Chip Bonder Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson

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Equipment name & Badger ID	Technique	Cleaning Required	Cleanliness	Material Thickness Range	Materials Lab Supplied	Minimum Resolution	Objective Separation	Process Temperature Range	Chemicals	Gases	Substrate Size	Substrate Type	Maximum Load
AFM-Asylum afm-asylum	Characterization > Surface Analysis > Profilometer > Atomic Force Microscopy (AFM)		Flexible								Pieces 2" 3"
Aix200 aix200	Deposition > Deposited III-V Deposition > Chemical Vapor Deposition (CVD) > Metal-Organic (MO) CVD	Pre-Diffusion Clean, Special: See Notes	Flexible	0 - 5 μm	AlAs AlGaAs GaAs GaP GaPN III-V materials InAs InGaAs InGaAsN			300 °C - 800 °C		H₂ MO sources N₂ SiH₄	Pieces 2" 3" 4"	(Si) , (SiO2) , (III-V) , (GaAs)	4"x1 wafer or 2"x1 wafer or 4 pieces
Aixtron Black Magic graphene CVD furnace aixtron-graphene	Deposition > Chemical Vapor Deposition (CVD) > Graphene CVD Growth		Flexible		C			800 °C - 1100 °C		78% N₂, 21% O₂, ~1% Ar CH₄ H₂	Pieces 2" 3" 4"	(Si) , (Various)	1x4" wafer or Copper/Nickel foil
AJA Evaporator aja-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation		Flexible	0 - 300 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania						Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various)	4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer alphastep	Characterization > Surface Analysis > Profilometer > Step Profile		Flexible								Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Alveole Primo alveole	Patterning > Protein patterning		Flexible
Aw610_r aw610_r	Annealing & Oxidation > Rapid Thermal Annealing		Flexible					21 °C - 1150 °C		4% H₂ in N₂ Ar N₂ NH₃ O₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)
Biologic SP-300 biologic	Characterization Other		Flexible
Blue M Oven bluem	Optical Photolithography > Resist Bake > Oven Bake		Flexible					0 °C - 430 °C			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Critical Point Dryer cpd	Drying > CO2 Drying		Flexible						CO₂		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)
CytoViva HSI cytoviva	Characterization		Flexible
DISCO Backgrinder disco-backgrind	Machining		Flexible
DISCO Wafer Saw DISCO wafersaw	Machining > Wafer Saw		Flexible								Pieces 2" 3" 4" 6" 8"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1x4", 1x6" or 1x8" wafer, or pieces
Epilog Fusion M2 Laser Cutter lasercutter	Machining > Laser Cutting		Flexible
EV Group Wafer Bonder evbond	Bonding		Flexible								Pieces 2" 3" 4"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (SiC) , (LiNb)
Ex Fab Develop Wet Bench wbexfab_dev	Optical Photolithography > Resist Develop		Flexible								Pieces 2" 3" 4" 6" 8" 12" Other
Ex Fab Solvent Wet Bench wbexfab_solv	Patterning > Metal Lift-off Cleaning > Solvent Cleaning		Flexible						Solvents		Pieces 2" 3" 4" 6" 8" Other
Fiji 2 fiji2	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD		Flexible	1 Å - 50 nm	Metal oxides Ga₂O₃ HfN In₂O₃ Ni_xO_y Pt Ru SiN SiO₂ SnO₂ SrO Ta₂O₅ TiN Various Dielectrics Alumina Hafnia ITO Moly Oxide Titania Zirconia			24 °C - 350 °C		Ar H₂ N₂ O₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (Various) , (Various) , (LiNb) , (Various)
Fiji 3 fiji3	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD		Flexible	1 Å - 50 nm	SiO₂ Various Dielectrics Alumina Hafnia Titania			24 °C - 350 °C		Ar H₂ N₂ NH₃ O₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (III-V)
Finetech Lambda flipchipbonder	Bonding		Flexible					°C - 400 °C			Pieces 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge)	1

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