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Silicon Dioxide

Chemical Formula:

SiO₂

Equipment Tabs

Deposition Equipment

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
AJA Evaporator aja-evap	Flexible	SNF Exfab Paul G Allen 155A Venice	0 - 300 nm	Ag Al Al₂O₃ Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti TiO₂
Fiji 1 fiji1	Semiclean	SNF Cleanroom Paul G Allen L107	1 Å - 50 nm	Metal oxides Al₂O₃ HfN HfO₂ Pt Ru SiO₂ Ta₂O₅ TaN TiN TiO₂ Various Dielectrics ZrO₂
Fiji 2 fiji2	Flexible	SNF Cleanroom Paul G Allen L107	1 Å - 50 nm	Metal oxides Al₂O₃ Ga₂O₃ HfN HfO₂ In₂O₃ In_xSn_yO_z MoO₃ Ni_xO_y Pt Ru SiN SiO₂ SnO₂ SrO Ta₂O₅ TiN TiO₂ Various Dielectrics ZrO₂
Fiji 3 fiji3	Flexible	SNF Cleanroom Paul G Allen L107	1 Å - 50 nm	Al₂O₃ HfO₂ SiO₂ TiO₂ Various Dielectrics
Lesker Sputter lesker-sputter	Flexible	SNF Exfab Paul G Allen 155A Venice		Ag Al Al₂O₃ AlSi Au Co Cr Cu Fe In_xSn_yO_z Nb Ni Pd Si SiO₂ Ta Ti TiN W
Lesker2 Sputter lesker2-sputter	Semiclean	SNF Cleanroom Paul G Allen L107	1 μm	Ag Al Al₂O₃ AlSi Cr Ge In_xSn_yO_z Mo Pd Ru Sc Si SiO₂ Sn Ta Ti TiN W
Teos2 teos2	Clean	SNF Cleanroom Paul G Allen L107	50 Å - 5 μm	SiO₂
ThermcoLTO thermcoLTO	Flexible	SNF Cleanroom Paul G Allen L107	100 Å - 3 μm	SiO₂
TylanBPSG tylanbpsg	Clean Semiclean	SNF Cleanroom Paul G Allen L107	100 Å - 3 μm	SiO₂

Etch Equipment

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched
AMAT P5000 Etcher p5000etch	Clean Clean (Ge) Semiclean	SNF Cleanroom Paul G Allen L107	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten
AMT Oxide Plasma Etcher amtetcher	Clean Semiclean	SNF Cleanroom Paul G Allen L107	Si SiN SiO₂ Resist	C SiC SiON PI
Drytek 100 Plasma Etcher drytek2	All	SNF Cleanroom Paul G Allen L107	Si SiN Poly Silicon Resist	C SiO₂ PI
Oxford Dielectric Etcher oxford-rie	Flexible	SNF Cleanroom Paul G Allen L107	SiC SiN SiO₂ PI	C
Oxford PlasmaPro 80 - Reactive Ion etcher RIE: Oxford PlasmaPro 80 (at SNSF)			Si SiN SiO₂	C Ti TiN W PI
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox	Flexible	SNF Cleanroom Paul G Allen L107	C SiC SiN SiO₂	Si based materials Various C-based
Samco PC300 Plasma Etch System samco	Flexible	SNF Cleanroom Paul G Allen L107	Resist	Si based materials dimethylpolysiloxane Si SiN SiO₂ SiON Various polymers PI Poly Silicon
SPTS uetch vapor etch uetch	All	SNF Cleanroom Paul G Allen L107	SiO₂
Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	SNF Cleanroom Paul G Allen L107	Al Au Cr Si SiO SiO₂ Resist