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AMAT P5000 Etcher (p5000etch)

Overview

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is ainly uused for silicon etching with high slectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers.  Pieces have to be attached to a 4" wafer.  Though the process chamber processes one wafer at a time, upto 25 wafers can be loaded per batch. Note that transparent wafers can not be loaded in the automatic processing mode.  P5000 is currently classified as CMOS restricted.  Chamber A - Metal Etch Chamber - Not working Chamber B - Oxide Etch Chamber  Chamber C - Poly Etch Chamber Note that all gases are not connected to all the chambers.  For details refer to the operating instructions.

Lab Organization, Location, and Badger Information

Badger Area: 
SNF: Dry Etching
Badger ID: 
p5000etch

Training and Maintenance

photo of p5000 etcher in SNF cleanroom
Lab Facility: 
Training Charges: 
1.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures before the training session:
  2. Contact the primary trainer: .

Operating Instructions