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AMAT P5000 Etcher (p5000etch)

Overview

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is ainly uused for silicon etching with high slectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers.  Pieces have to be attached to a 4" wafer.  Though the process chamber processes one wafer at a time, upto 25 wafers can be loaded per batch. Note that transparent wafers can not be loaded in the automatic processing mode.  P5000 is currently classified as CMOS restricted.  Chamber A - Metal Etch Chamber - Not working Chamber B - Oxide Etch Chamber  Chamber C - Poly Etch Chamber Note that all gases are not connected to all the chambers.  For details refer to the operating instructions.

Lab Facility, Location, and Badger Information

Training and Maintenance

photo of p5000 etcher in SNF cleanroom
Lab Facility: 
Training Charges: 
1.00 hours
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures before the training session:
  2. Check the training calendar for any scheduled training: .
  3. Contact the primary trainer,
    , to sign up for the training or to schedule a training if none is scheduled.
  4. Attend the in-person training session to get qualified.

Operating Instructions