Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Overview
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch process.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Process Temperature Range:
Gases
Substrate Sizes
Maximum Load:
1
Notes:
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching
Lab Organization, Location, and Badger Information
Lab Organization:
Location:
Badger Area:
SNF: Dry Etching
Badger ID:
PT-DSE
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Check the training calendar to for any scheduled training: .
- Contact the primary trainer, , to sign up for the training or to schedule a training if none is scheduled.
- Online training and completing the quiz is required. See Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "PlasmaTherm Etchers Guide" section for watching the video and taking the quiz. For optional overview of plasma etching and how to choose an etcher, go to the "Dry Etching" Section for the three videos on plasma etching principles and "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - Complete the quiz on equipment operations. Attend the training to get qualified.
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