Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch process.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Check the training calendar to for any scheduled training:
Online training and completing the quiz is required. See Online training required. Open Online Course
for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login
to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "PlasmaTherm Etchers Guide" section for watching the video and taking the quiz. For optional overview of plasma etching and how to choose an etcher, go to the "Dry Etching" Section for the three videos on plasma etching principles and "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Complete the quiz on equipment operations. Attend the training to get qualified.