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Dry Resist Removal

Dry resist removal, called Ashing, uses O2 plasma to react with the resist to remove it from the substrate.

The asher you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

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Cleanliness Equipment name & Badger ID Location Image Overview Link to Training
Clean, Semiclean Gasonics Aura Asher
SNF Cleanroom Paul G Allen L107

The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist of clean 4 inch wafers...Read more

Gasonics Aura Asher Training
Flexible Matrix Plasma Resist Strip
SNF Cleanroom Paul G Allen L107
photo of matrix in SNF cleanroom

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power,...Read more

Matrix Plasma Resist Strip Training
Flexible Samco PC300 Plasma Etch System
SNF Cleanroom Paul G Allen L107
Samco Training
Flexible Technics Asher
SNF Cleanroom Paul G Allen L107

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma at ambient temperature.  It is...Read more

Technics Asher Training