SNF is open under New Normal Rules. ANY shadowing must be coordinated with SNF staff first.
Dry Resist Removal
Dry resist removal, called Ashing, uses O2 plasma to react with the resist to remove it from the substrate.
The asher you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).
| Cleanliness | Equipment name & Badger ID | Location | Image | Overview | Link to Training |
|---|---|---|---|---|---|
| Clean, Semiclean |
Gasonics Aura Asher gasonics |
SNF Cleanroom Paul G Allen L107 |
 |
The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist of clean 4 inch wafers...Read more |
Gasonics Aura Asher Training |
| Flexible |
Matrix Plasma Resist Strip matrix |
SNF Cleanroom Paul G Allen L107 |
 |
The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power,...Read more |
Matrix Plasma Resist Strip Training |
| Flexible |
Samco PC300 Plasma Etch System samco |
SNF Cleanroom Paul G Allen L107 |
 |
Samco Training | |
| Flexible |
Technics Asher technics |
SNF Cleanroom Paul G Allen L107 |
 |
Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma at ambient temperature. It is...Read more |
Technics Asher Training |
