Dry Resist Removal

Dry resist removal, called Ashing, uses O2 plasma to react with the resist to remove it from the substrate.

The asher you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

Technique Tabs

Main Tab

Processing Techniques	Equipment name & Badger ID	Teaser Blurb	Cleanliness	Location
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Gasonics Aura Asher gasonics	The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.	Clean, Semiclean	SNF Cleanroom Paul G Allen L107
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Matrix Plasma Resist Strip matrix	The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).	Flexible	SNF Cleanroom Paul G Allen L107
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal	Samco PC300 Plasma Etch System samco	The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch (similar to Drytek 2) or Downstream plasma modes	Flexible	SNF Cleanroom Paul G Allen L107
Dry Resist Removal, Dry Etching	Technics Asher technics	Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma	Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & Badger ID	Cleanliness	Primary Materials Etched	Other Materials Etched	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Gases	Notes
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Gasonics Aura Asher gasonics	Clean, Semiclean	Resist	PI	4"	25		O₂	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Matrix Plasma Resist Strip matrix	Flexible	Resist	PI	4"	25		O₂	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal	Samco PC300 Plasma Etch System samco	Flexible	Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI	Pieces 2" 3" 4" 6" 8" Other	Four 4" wafers or two 6" wafers and one 8" wafer	20 ºC	CF₄ O₂ SF₆
Dry Resist Removal, Dry Etching	Technics Asher technics	Flexible	Resist	dimethylpolysiloxane poly(p-xylylene) PI	Pieces 4" 6" 8"	Four 4" wafers to pieces, one 6" or 8" wafer		O₂

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Techniques

Dry Resist Removal

Technique Tabs