Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Overview
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and deep glass/quartz etching.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Sizes
Maximum Load:
1
Notes:
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Lab Facility, Location, and Badger Information
Lab Organization:
Location:
Badger ID:
PT-Ox
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- This training is common for both PT-OX and PT-MTL etchers.
- Check the training calendar to for any scheduled training: .
- Contact the primary trainer, , to sign up for the training.
- Read the relevant operating procedures before the training session.
- Online training and completing the quiz is required. See Online training required. Open Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "PlasmaTherm Etchers Guide" section for watching the video and taking the quiz. For optional overview of plasma etching and how to choose an etcher, go to the "Dry Etching" Section for the three videos on plasma etching principles and "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - Complete the quiz on equipment operations. Attend the training to get qualified.
Printer-friendly version