Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and deep glass/quartz etching.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Lab Organization, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
This training is common for both PT-OX and PT-MTL etchers.
Check the training calendar to for any scheduled training:
Read the relevant operating procedures before the training session.
Online training and completing the quiz is required. See Online Course
for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login
to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "PlasmaTherm Etchers Guide" section for watching the video and taking the quiz. For optional overview of plasma etching and how to choose an etcher, go to the "Dry Etching" Section for the three videos on plasma etching principles and "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Complete the quiz on equipment operations. Attend the training to get qualified.