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Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)


photo of PT-Ox in SNF Cleanroom
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and deep glass/quartz etching.

Capabilities and Specifications

Process Temperature Range: 
Maximum Load: 

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Lab Organization, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. This training is common for both PT-OX and PT-MTL etchers.
  2. Check the training calendar to for any scheduled training: .
  3. Contact the primary trainer, , to sign up for the training.
  4. Read the relevant operating procedures before the training session.
  5. Complete the quiz on equipment operations.  Attend the training to get qualified.