We have started collecting "Nano Nuggets"- useful bits of information about different processing methods that should be extremely helpful either in getting started or avoiding pitfalls along the way. Some of them are parts of more detailed project reports, so if you want more info about a nugget, the report should be linked. Check them out!
A step-by-step procedure for biolayer fabrication is documented. The process is undergoing refinement but this is a good start!
A step-by-step procedure for cleaning the Aixtron BM in the SNF is documented.
The SOP with details for Cuprite growth is documented here.
Adhesion between metals and polymers are rarely explored. For each type of polymer and metal combination, a customized adhesion method needs to be established- here is a case study for PDMS and Gold adhesion.
A process flow of resist-free nanostencil lithography technique that allows sub-micron metal patterningon a polymer substrate is established.
Practical advice documented by our E241 students about how to solve commonly encountered issues while using the nanoscribe.
The steps involved in printing a microlens with the nanoscribe are documented for your reference.
In this SOP we present a release process that was tested for structures made of aluminum and lithium niobate that are partially masked by SPR-3612, but the process should be applicable to other materials/photoresist, provided they are not etched by SF6.
One can accurately determine horizontal etch rates by looking at unreleased structures with an overhead SEM. However, this will only work with materials that one can see through with the SEM, such as thin film aluminum and similar materials with low atomic number.
When bonding plasma activated surfaces together, it is important to apply a sufficient amount of force to the chips when pressing them together to properly initiate the bond. Pressing with tweezers is an easy and effective, as well as tricky way to do this. Check out the tips and tricks!
The drop gauge is a simple to use, tabletop vertical displacement measuring device in SNF. It has micron level resolution and can be used to characterize micron to millimeter scale etch rates.
Plasma activation allows the chips to be bonded together without an adhesive layer.
Our E241 students demonstrate their technique for bonding pieces of Si and LiNb with tweezers.
Tips for wet etching of glass substrates with resist adhesion problems.
Our goal was to develop a process for sputtering of NVM-quality TiN using the new Lesker sputtering tool (Lesker-2) that resides inside the cleanroom. This tool can achieve the high-vacuum pressures necessary for TiN films with low levels of oxygen contamination.
The nanoscribe can be used to create template structures for particle self assembly, and details about inverse opal BCC and FCC structures are described.