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Sulfur Hexafluoride

Chemical Formula:

SF₆

Gases Equipment Tabs

Etch Equipment Table

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched	Gases
AMAT P5000 Etcher p5000etch	Clean Clean (Ge) Semiclean	SNF Cleanroom Paul G Allen L107	Si Si3N4 SiGe SiO₂ SiON	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten	80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
MRC Reactive Ion Etcher mrc	Flexible	SNF Cleanroom Paul G Allen L107	Metals Various Dielectrics	Metal oxides PI	Ar CHClF₂ CHF₃ O₂ SF₆
Oxford Dielectric Etcher oxford-rie	Flexible	SNF Cleanroom Paul G Allen L107	Si3N4 SiC SiO₂ PI	C	Ar CF₄ CHF₃ N₂ O₂ SF₆
Oxford III-V etcher Ox-35	Flexible	SNF Cleanroom Paul G Allen L107	GaAs	AlGaN AlInP GaN InGaP InSb	Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Flexible	SNF Cleanroom Paul G Allen L107	Si		Ar C₄F₈ O₂ SF₆
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Flexible	SNF Cleanroom Paul G Allen L107	Metals or metal compounds with volatile byproducts Metals or metal compounds without volatile byproducts Al	GaN	Ar BCl₃ CF₄ CH₄ Cl₂ N₂ O₂ SF₆
Samco PC300 Plasma Etch System samco	Flexible	SNF Cleanroom Paul G Allen L107	Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI	CF₄ O₂ SF₆
STS Deep RIE Etcher stsetch	Clean Semiclean	SNF Cleanroom Paul G Allen L107	Si	Ge SiGe	C₄F₈ O₂ SF₆

Anneal/Oxidation Equipment Table

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
PlasmaTherm Shuttlelock PECVD System ccp-dep	All	SNF Cleanroom Paul G Allen L107	100 Å - 4 μm	Si Si3N4 SiC SiO₂ SiON
PlasmaTherm Versaline HDP CVD System hdpcvd	All	SNF Cleanroom Paul G Allen L107	500 Å - 4 μm	Si Si3N4 SiC SiO₂ SiON