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Inductively Coupled Plasma Etching (ICP)

Inductively coupled plasma etchers produce higher plasma density and are hence called HDP, High Density Plasma, systems. These have two sources of plasma power. The first, a non-capacitive coupled source, such as inductively coupled (ICP) or ECR coupled, where power is transferred or coupled to the plasma with minimal voltage difference between the plasma and the wafer (about 50 V or less). The inductively coupled plasma referred to as the source power, controls the plasma density (number of ions per cc) and thus controls the ions flux (ions per sq cm per sec) bombarding the wafer. The second power source is the bias power and is connected through the wafer chuck/electrode and is capacitively coupled (CCP). The bias power is used to control the voltage between the wafer and the plasma. This voltage between wafer and plasma is important, as it controls the energy and directionality of the ions bombarding the wafer surface. Thus, with high density plasmas we have the ability to control both ion flux and ion energy independently.

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Equipment name & Badger ID Location Image Overview Primary Materials Etched Link to Training
Lam Research TCP 9400 Poly Etcher
lampoly
SNF Cleanroom Paul G Allen L107
photo of lampoly etcher in SNF cleanroom

Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and...Read more

Lam Research TCP 9400 Poly Etcher Training
Oxford III-V etcher
Ox-35
SNF Cleanroom Paul G Allen L107
photo of ox35 in SNF Cleanroom

The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed...Read more

Oxford III-V etcher Training
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
SNF Cleanroom Paul G Allen L107
photo of PT-DSE in SNF Cleanroom
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch...Read more
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
SNF Cleanroom Paul G Allen L107
photo of PT-Ox in SNF Cleanroom
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and...Read more Plasma Therm Versaline LL ICP Dielectric Etcher Training
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
SNF Cleanroom Paul G Allen L107
photo of ptmtl in SNF Cleanroom
The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on...Read more Plasma Therm Versaline LL ICP Metal Etcher Training
STS Deep RIE Etcher
stsetch
SNF Cleanroom Paul G Allen L107
photo of stsetch in SNF Cleanroom

This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems....Read more

STS Deep RIE Etcher Training