Lam Research TCP 9400 Poly Etcher (lampoly)
Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and single crystal Silicon etches; maximum etch depth 3um.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
Lab Organization, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Online training is optional. Online Course
for general information about the online training. Go to Online Nano Course Login
to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF