Equipment name & Badger ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Developer | Objective Separation | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
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AFM-Asylum afm-asylum |
Flexible |
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Aixtron Black Magic graphene CVD furnace aixtron-graphene |
Flexible |
|
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|
800 °C - 1100 °C
|
, |
1x4" wafer or Copper/Nickel foil | |||||||||||
Aixtron MOCVD - III-N system aix-ccs |
Clean (MOCVD) |
0 -
5 μm
|
|
|
400 °C - 1300 °C
|
, , , |
4"x1, 2"X3, pieces | |||||||||||
Aixtron MOCVD - III-V system aix200 |
Pre-Diffusion Clean | Flexible |
0 -
5 μm
|
|
|
300 °C - 800 °C
|
, , , |
4"x1 wafer or 2"x1 wafer or 4 pieces | ||||||||||
AJA Evaporator aja-evap |
Flexible |
0 -
300 nm
|
|
|
|
, , , , , , , , , , , |
4"x3 or 6"x1 wafers or pieces | |||||||||||
AJA2 Evaporator aja2-evap |
Semiclean |
0 -
300 nm
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|
, , , , , |
4"x3 or 6"x1 wafers or pieces | |||||||||||
AllWin 610 RTA aw610_l |
Pre-Diffusion Clean | Clean |
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|
|
21 °C - 1150 °C
|
, , |
1 wafer | ||||||||||
AllWin 610 RTA (aw610_r) aw610_r |
Flexible |
|
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|
21 °C - 1150 °C
|
, , |
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Alphastep 500 Profilometer alphastep |
Flexible |
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1 | |||||||||||
DISCO Wafer Saw DISCO wafersaw |
Flexible |
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, , , , , , , , |
1x4", 1x6" or 1x8" wafer, or pieces | |||||||||||
EV Group Contact Aligner evalign |
All |
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350 - 450 nm | 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch |
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, , , , |
one piece or wafer | ||||||||
EV Group Wafer Bonder evbond |
Flexible |
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|
, , , , , |
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EVG 101 Spray Coater evgspraycoat |
All |
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, , , , |
1 | |||||||||||
Ex Fab Develop Wet Bench wbexfab_dev |
Flexible |
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Ex Fab Solvent Wet Bench wbexfab_solv |
Flexible |
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Fiji 1 ALD fiji1 |
Semiclean |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , |
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Fiji 2 ALD fiji2 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , , , , , , , , , , , |
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Fiji 3 ALD fiji3 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , |
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Finetech Lambda flipchipbonder |
Flexible |
|
|
|
°C - 400 °C
|
, , , , , |
1 | |||||||||||
First Nano carbon nanotube CVD furnace cvd-nanotube |
Flexible |
|
|
|
800 °C - 1100 °C
|
, |
1x4" wafer or multiple pieces |