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Reactive Ion Etching (RIE)

Reactive ion etchers are parallel plate, capacitively coupled plasma etchers wherein the substrate sits on the powered electrode.  An RF power, in most cases at 13.56MHz, is applied to the powered electrode.  The powered electrode area is typically smaller than the grounded electrode area.  Gases that are fed into the chamber are ioized and produce a gaseous mixture of neutral and ionized species.  The positively charged species accelerate toward the biased electrode where the substrate is placed and causes the etching of the substrate.  It is also called ion assisted etching as neutrals also participate in the etching process.

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Equipment name & Badger ID Location Image Overview Primary Materials Etched Link to Training
AMAT P5000 Etcher
SNF Cleanroom Paul G Allen L107

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more

AMAT P5000 Etcher Training
MRC Reactive Ion Etcher
SNF Cleanroom Paul G Allen L107
photo of mrc etcher in SNF cleanroom
The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more MRC Reactive Ion Etcher Training
Oxford Dielectric Etcher
SNF Cleanroom Paul G Allen L107
photo of oxrie etcher in SNF Cleanroom
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more Oxford Dielectric Etcher Training
Plasmaetch PE-50
SNF Exfab Paul G Allen 155 Mavericks

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for...Read more

Plasmaetch PE-50 Training
Samco PC300 Plasma Etch System
SNF Cleanroom Paul G Allen L107
Samco Training