Reactive Ion Etching (RIE)
Reactive ion etchers are parallel plate, capacitively coupled plasma etchers wherein the substrate sits on the powered electrode. An RF power, in most cases at 13.56MHz, is applied to the powered electrode. The powered electrode area is typically smaller than the grounded electrode area. Gases that are fed into the chamber are ioized and produce a gaseous mixture of neutral and ionized species. The positively charged species accelerate toward the biased electrode where the substrate is placed and causes the etching of the substrate. It is also called ion assisted etching as neutrals also participate in the etching process.
| Equipment name & Badger ID | Location | Image | Overview | Primary Materials Etched | Link to Training |
|---|---|---|---|---|---|
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AMAT P5000 Etcher p5000etch |
SNF Cleanroom Paul G Allen L107 |
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P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more |
AMAT P5000 Etcher Training | |
|
MRC Reactive Ion Etcher mrc |
SNF Cleanroom Paul G Allen L107 |
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The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more | MRC Reactive Ion Etcher Training | |
|
Oxford Dielectric Etcher oxford-rie |
SNF Cleanroom Paul G Allen L107 |
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Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more | Oxford Dielectric Etcher Training | |
|
Plasmaetch PE-50 plasma-etch |
SNF Exfab Paul G Allen 155 Mavericks |
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The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for...Read more |
Plasmaetch PE-50 Training | |
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Samco PC300 Plasma Etch System samco |
SNF Cleanroom Paul G Allen L107 |
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Samco Training |
