Aix-ccs aix-ccs |
Aixtron MOCVD - III-N system training |
Clean (MOCVD) |
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SNF MOCVD Paul G Allen 213XA |
N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.
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AJA2 Evaporator aja2-evap |
AJA2 Evaporator |
Semiclean |
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SNF Cleanroom Paul G Allen L107 |
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
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AMAT P5000 Etcher p5000etch |
AMAT P5000 Etcher Training |
Clean, Clean (Ge), Semiclean |
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SNF Cleanroom Paul G Allen L107 |
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Aw610_l aw610_l |
AllWin 610 RTA Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
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Epi2 epi2 |
AMAT Centurion Epitaxial Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr
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Fiji 1 fiji1 |
Fiji 1 and 2 Training |
Semiclean |
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SNF Cleanroom Paul G Allen L107 |
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Gasonics Aura Asher gasonics |
Gasonics Aura Asher Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
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Intlvac Evaporation Intlvac_evap |
Intlvac Evaporation Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
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Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
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Lesker2 Sputter lesker2-sputter |
Lesker2 Sputter Training |
Semiclean |
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SNF Cleanroom Paul G Allen L107 |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
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STS Deep RIE Etcher stsetch |
STS Deep RIE Etcher Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching
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Tencor P2 Profilometer p2 |
Tencor P2 Profilometer Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
Step height measurement range 500 Å to 80 µm
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Teos2 teos2 |
Teos Deposition Furnace Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
Very conformal.
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Thermco1 thermco1 |
Thermco Oxidation Furnaces Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.
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Thermco3 thermco 3 |
Thermco Oxidation Furnaces Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.
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ThermcoNitride thermconitride1 |
Thermco Nitride Deposition Furnace Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
Stociometric and low stress (~150mPa) programs available
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ThermcoPoly1 thermcopoly1 |
Thermco Poly Deposition Furnace Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.
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TylanBPSG tylanbpsg |
TylanBPSG Deposition Furnace Training |
Clean, Semiclean |
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SNF Cleanroom Paul G Allen L107 |
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Tylanfga tylanfga |
Forming Gas Anneal Furnace Training |
Semiclean |
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SNF Cleanroom Paul G Allen L107 |
For standard metals deposited in Lesker2, Intlvac Sputter or Intlvac Evaporation only. N2 and Ar annealing available. Please contact staff for more information.
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Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean 1 and 2 Training |
Clean |
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SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha.
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