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Semiclean

The "Semiclean" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Semiclean" category.

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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AMAT P5000 Etcher
p5000etch
AMAT P5000 Etcher Training Clean, Clean (Ge), Semiclean
SNF
SNF Cleanroom Paul G Allen L107
AMT Oxide Plasma Etcher
amtetcher
AMT Oxide Plasma Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Batch processing tool with hexode configuration; pieces need to be mounted on a carrier wafer for etching

Fiji 1
fiji1
Fiji 1 and 2 Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Gasonics Aura Asher
gasonics
Gasonics Aura Asher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.

Intlvac Evaporation
Intlvac_evap
Intlvac Evaporation Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Lam Research TCP 9400 Poly Etcher
lampoly
Lam Research TCP 9400 Poly Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

STS Deep RIE Etcher
stsetch
STS Deep RIE Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

TylanBPSG
tylanbpsg
TylanBPSG Deposition Furnace Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Tylanfga
tylanfga
Forming Gas Anneal Furnace Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For standard metals deposited in Lesker2, Intlvac Sputter or Intlvac Evaporation only. N2 and Ar annealing available. Please contact staff for more information.

Wet Bench CMOS Metal (wbclean3)
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AMAT P5000 Etcher
p5000etch
Clean, Clean (Ge), Semiclean
AMT Oxide Plasma Etcher
amtetcher
Clean, Semiclean
24
Fiji 1
fiji1
Semiclean
1 Å - 50 nm
24 °C - 350 °C
,
,
Gasonics Aura Asher
gasonics
Clean, Semiclean
25
Intlvac Evaporation
Intlvac_evap
Clean, Semiclean
0 - 1 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
STS Deep RIE Etcher
stsetch
Clean, Semiclean
1
Tencor P2 Profilometer
p2
Clean, Semiclean
,
,
,
,
,
,
,
,
1
TylanBPSG
tylanbpsg
Pre-Diffusion Clean, Standard Metal Clean Clean, Semiclean
100 Å - 3 μm
300 °C - 450 °C
,
,
26
Tylanfga
tylanfga
Standard Metal Clean Semiclean
100 Å - 100 Å
250 °C - 800 °C
50
Wet Bench CMOS Metal (wbclean3)
wbclean3
Semiclean
,
,
25 wafers