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Silicon Carbide

Chemical Formula: 
SiC
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Equipment name & Badger ID Training Required & Charges Cleanliness Location Notes
Aixtron MOCVD - III-N system
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD) SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

AJA Evaporator
aja-evap
AJA Evaporation training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible SNF Exfab Paul G Allen 159 Capitola
EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible SNF Cleanroom Paul G Allen L107
Fiji 2 ALD
fiji2
Fiji 1 and 2 ALD Training Flexible SNF Cleanroom Paul G Allen L107
Headway Manual Resist Spinner
headway2
Headway Manual Resist Spinner Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Cleanroom Paul G Allen L107

Direct Write

Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All SNF Exfab Paul G Allen 151 Ocean
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter
lesker-sputter
Lesker Sputter Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All SNF Exfab Paul G Allen 151 Ocean
Oven 110°C post-bake
oven110
110°C Oven Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Savannah ALD
savannah
Savannah Training Flexible SNF Cleanroom Paul G Allen L107
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

Tousimis Automegasamdri-915B Critical Point Dryer
cpd
Critical Point Dryer Training Flexible SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Resist Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Aixtron MOCVD - III-N system
aix-ccs
Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
Fiji 2 ALD
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Lakeshore Hall Measurement System
LakeshoreHall
All
100 μm - 1000 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
micromanipulator6000 IV-CV probe station
micromanipulator6000
All
,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100 Å - 4 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
Tousimis Automegasamdri-915B Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,

Pages