Equipment name & Badger ID | Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Resist | Objective Separation | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
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110°C Oven oven110 |
All |
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110 ºC
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Aix-ccs aix-ccs |
Special: See Notes | Clean (MOCVD) |
0 -
5 μm
|
|
|
400 °C - 1300 °C
|
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4"x1, 2"X3, pieces | ||||||||||||
AJA Evaporator aja-evap |
Flexible |
0 -
300 nm
|
|
|
|
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4"x3 or 6"x1 wafers or pieces | |||||||||||||
Critical Point Dryer cpd |
Flexible |
|
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DISCO Wafer Saw DISCO wafersaw |
Flexible |
|
|
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|
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1x4", 1x6" or 1x8" wafer, or pieces | |||||||||||||
EV Group Wafer Bonder evbond |
Flexible |
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Fiji 2 fiji2 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
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Headway Manual Resist Spinner headway2 |
All |
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|
|
|
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one piece or wafer | |||||||||||||
Heidelberg MLA 150 heidelberg |
All |
|
|
405 nm |
|
|
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1 | ||||||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
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|
375 nm |
|
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1 | ||||||||||||
Lakeshore Hall Measurement System LakeshoreHall |
All |
100 μm -
1000 μm
|
|
|
-258 °C - 1000 °C
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 piece | |||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All |
|
|
|
|
8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | |||||||||||
Lesker Sputter lesker-sputter |
Flexible |
|
|
|
|
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1 4 inch wafer, 1 6 inch wafer | |||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1 μm
|
|
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | |||||||||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
|
|
|
|
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1x4" wafer | |||||||||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
|
|
|
|
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Samco PC300 Plasma Etch System samco |
Flexible |
|
|
|
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||||||||||
Savannah savannah |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 250 °C
|
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SPTS uetch vapor etch uetch |
All |
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1 | |||||||||||||
Wet Bench Flexcorr 1 wbflexcorr-1 |
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Flexible |
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