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Silicon Carbide

Chemical Formula: 
SiC
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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Fiji 2
fiji2
Fiji 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Headway Manual Resist Spinner
headway2
Headway Manual Resist Spinner Training All
SNF
SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Heidelberg MLA 150
heidelberg
Heidelberg Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All
SNF
SNF Cleanroom Paul G Allen L107

Direct Write

Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All
SNF
SNF Exfab Paul G Allen 151 Ocean
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter
lesker-sputter
Lesker Sputter Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Samco PC300 Plasma Etch System
samco
Samco Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Savannah
savannah
Savannah Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Resist Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Lakeshore Hall Measurement System
LakeshoreHall
All
100 μm - 1000 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
micromanipulator6000 IV-CV probe station
micromanipulator6000
All
,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible
,
,
,
,
,
,
,
,
,
,

Pages