Skip to content Skip to navigation

Capacitively Coupled Plasma Etching (CCP)

Capacitively coupled plasma is a plasma generated between two electrodes while reactive gases are fed into the chamber. The electrodes form the parallel plates of a capacitor and hence the resulting plasma is called a capacitively coupled plasma.  RF power is applied to one of the electrodes while the other is grounded.  In this mode, ions are accelerated from the plasma toward the powered electrode.  The potential difference between the plasma and the powered electrode is the bias voltage.  If the substrate is placed on the powered electrode, then the substrate experiences the bias voltage and the reactive ions as well as other reactive species from the plasma causes etching of the substrate. The resulting process is called the reactive ion etching.  If the substrate is placed on the grounded electrode, then the reaction is mainly caused by reactive neutral species as the voltage across the sheath is very small (less than about 50V).  This mode of etching is called the plasma mode etching.  

Subscribe to
Equipment name & Badger ID Location Image Overview Primary Materials Etched Link to Training
AMAT P5000 Etcher
p5000etch
SNF Cleanroom Paul G Allen L107

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more

AMAT P5000 Etcher Training
AMT Oxide Plasma Etcher
amtetcher
SNF Cleanroom Paul G Allen L107
photo of AMT etcher in SNF cleanroom
Reactive Ion Etcher for Oxides or Nitrides.  Also can be used for Si trench etching. Read more AMT Oxide Plasma Etcher Training
Drytek 100 Plasma Etcher
drytek2
SNF Cleanroom Paul G Allen L107
photo of drytek2 etcher in SNF cleanroom

The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various...Read more

Drytek 100 Plasma Etcher Training
MRC Reactive Ion Etcher
mrc
SNF Cleanroom Paul G Allen L107
photo of mrc etcher in SNF cleanroom
The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more MRC Reactive Ion Etcher Training
Oxford Dielectric Etcher
oxford-rie
SNF Cleanroom Paul G Allen L107
photo of oxrie etcher in SNF Cleanroom
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more Oxford Dielectric Etcher Training
Oxford PlasmaPro 80 - Reactive Ion etcher
RIE: Oxford PlasmaPro 80 (at SNSF)
Oxford PlasmaPro 80 - Reactive Ion etcher Training
Plasmaetch PE-50
plasma-etch
SNF Exfab Paul G Allen 155 Mavericks

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for...Read more

Plasmaetch PE-50 Training
Samco PC300 Plasma Etch System
samco
SNF Cleanroom Paul G Allen L107
Samco Training