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Wafer Saw

The wafer saw is used to cut substrates into smaller pieces.

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Equipment name & Badger ID Location Image Overview Link to Training
DISCO Wafer Saw
DISCO wafersaw
SNF Exfab Paul G Allen 159 Capitola

Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.  

DISCO wafersaw training