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Machining techniques are physical methods of shaping materials (in contrast to primarily chemical methods).

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Equipment name & Badger ID Location Image Overview Link to Training
DISCO Backgrinder
SNF Exfab Paul G Allen 159 Capitola

DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.

DISCO Backgrinder Training
DISCO Wafer Saw
DISCO wafersaw
SNF Exfab Paul G Allen 159 Capitola

Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.  

DISCO wafersaw training
Epilog Fusion M2 Laser Cutter
SNF Exfab Paul G Allen 155A Venice

This system is configured with two, 50 W lasers:  a CO2 laser, generally used for cutting (10.6 um wavelength, nominally 75 um wide) and a fiber laser, generally used for engraving (1 um wavelength, nominally 10 um wide).  The write area is 32" X 20", with resolution up to 1200 dpi.  This system can be used to engrave metal and cut wood, paper, plastic, and silicon.

The laser cutter is set up to print from CorelDraw X8 files, in vector mode, raster mode, or a combination of the two, as defined by the print file.  AutoCAD and other file formats can be imported into CorelDraw for printing.  CorelDraw X8 is available on the shared desktop kiosks at SNF.

Lasercutter Training
SNF Exfab Paul G Allen 159 Capitola

The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surfaces, and to smooth surface roughness.

CMP Training
Minitech-GX Micromill
SNF Exfab Paul G Allen 155 Mavericks

The micromill is a CNC based mill capable of making small parts with intricate detail with aspect ratios up to 3:1 (depth:width).

Micromill Training