Dry Etching

Documentation

• Attaching Samples to Carrier Wafers for Etching or Deposition

• Bulk Silicon Carbide Etching in PT-MTL- Final Report

• Community Service Project Proposal: Expanding STS2 Etch Capabilities for High Aspect Ratio/Deep Trenches

• Deep oxide etch in Pt-Ox to replace dicing & polishing process- Final Presentation

• Deep oxide etch in Pt-Ox to replace dicing and polishing process- Final Report

• 

  Determining etch rates with partially released structures

  One can accurately determine horizontal etch rates by looking at unreleased structures with an overhead SEM. However, this will only work with materials that one can see through with the SEM, such as thin film aluminum and similar materials with low atomic number.

• Developing Etching Process for Nanostructures on InGaP and AlInP Using OX-35 Etcher- Final Presentation

• Developing Etching Process for Nanostructures on InGaP and AlInP Using OX-35 Etcher- Final Report

• Development of Fluorine Plasma Treatment for AlGaN/GaN Device Isolation- Final Presentation

• Dry Etch Equipment Overview

• F19- Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing

• High Aspect Ratio Si Etching in STS2- Final Presentation

• High Aspect Ratio Si Etching in STS2- Final Report

• Optimization of Isotropic Plasma Etch in PT-DSE for GOPHER Process- Final Presentation

Project

• Bulk Silicon Carbide etching in PT-MTL

• Deep Oxide Etch in PT-Ox to Replace Dicing and Polishing Process

• Developing Etching Process for Nanostructures on InGaP and AlInP Using OX-35 Etcher

• Dry Etching of InSb Using OX-35 Etcher

• Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing

• High Aspect Ratio Si Etching in STS2