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Dry Etching

Dry etching refers to the processes that use energetic gaseous species produced by a plasma to remove material. In order to modulate and control the etching conditions and characteristics, different types of plasma sources are utilized in the dry etching process and the equipment are categorized accordingly.
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Equipment name & Badger ID Location Image Overview Primary Materials Etched Link to Training
AMAT P5000 Etcher
p5000etch
SNF Cleanroom Paul G Allen L107

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more

AMAT P5000 Etcher Training
AMT Oxide Plasma Etcher
amtetcher
SNF Cleanroom Paul G Allen L107
photo of AMT etcher in SNF cleanroom
Reactive Ion Etcher for Oxides or Nitrides.  Also can be used for Si trench etching. Read more AMT Oxide Plasma Etcher Training
Drytek 100 Plasma Etcher
drytek2
SNF Cleanroom Paul G Allen L107
photo of drytek2 etcher in SNF cleanroom

The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various...Read more

Drytek 100 Plasma Etcher Training
Gasonics Aura Asher
gasonics
SNF Cleanroom Paul G Allen L107

The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist...Read more

Gasonics Aura Asher Training
Intlvac Ion Mill Etcher
Ion Mill_fcr (at SNSF)
Intlvac Ion Mill Etcher Training
Lam Research TCP 9400 Poly Etcher
lampoly
SNF Cleanroom Paul G Allen L107
photo of lampoly etcher in SNF cleanroom

Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and...Read more

Lam Research TCP 9400 Poly Etcher Training
Matrix Plasma Resist Strip
matrix
SNF Cleanroom Paul G Allen L107
photo of matrix in SNF cleanroom

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination...Read more

Matrix Plasma Resist Strip Training
MRC Reactive Ion Etcher
mrc
SNF Cleanroom Paul G Allen L107
photo of mrc etcher in SNF cleanroom
The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more MRC Reactive Ion Etcher Training
Oxford Dielectric Etcher
oxford-rie
SNF Cleanroom Paul G Allen L107
photo of oxrie etcher in SNF Cleanroom
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more Oxford Dielectric Etcher Training
Oxford III-V etcher
Ox-35
SNF Cleanroom Paul G Allen L107
photo of ox35 in SNF Cleanroom

The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed...Read more

Oxford III-V etcher Training
Oxford PlasmaPro 80 - Reactive Ion etcher
RIE: Oxford PlasmaPro 80 (at SNSF)
Oxford PlasmaPro 80 - Reactive Ion etcher Training
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
SNF Cleanroom Paul G Allen L107
photo of PT-DSE in SNF Cleanroom
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch...Read more
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
SNF Cleanroom Paul G Allen L107
photo of PT-Ox in SNF Cleanroom
The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and...Read more Plasma Therm Versaline LL ICP Dielectric Etcher Training
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
SNF Cleanroom Paul G Allen L107
photo of ptmtl in SNF Cleanroom
The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on...Read more Plasma Therm Versaline LL ICP Metal Etcher Training
Plasmaetch PE-50
plasma-etch
SNF Exfab Paul G Allen 155 Mavericks

The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for...Read more

Plasmaetch PE-50 Training
Samco PC300 Plasma Etch System
samco
SNF Cleanroom Paul G Allen L107
Samco Training
STS Deep RIE Etcher
stsetch
SNF Cleanroom Paul G Allen L107
photo of stsetch in SNF Cleanroom

This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems....Read more

STS Deep RIE Etcher Training
Technics Asher
technics
SNF Cleanroom Paul G Allen L107

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma...Read more

Technics Asher Training

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