Bonding is a method of applying heat and/or pressure to two substrates to bond them together. Different equipment will have different substrate size tolerances and use different methods to create the bond.
|Equipment name & Badger ID||Location||Substrate Size||Substrate Type||Overview||Link to Training|
EV Group Wafer Bonder
|SNF Cleanroom Paul G Allen L107||Silicon, Quartz, Sapphire, Glass, Silicon Carbide, Lithium Niobate||The Electronic Visions system is comprised of the precision optical 620 Aligner and the 501...||EV Group Wafer Bonder Training|
|SNF Exfab Paul G Allen 104 Stinson||Silicon, Silicon Germanium, Quartz, Sapphire, Glass, Germanium||FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging....||Flip Chip Bonder Training|
Karl Suss Wafer Bonder
|SNF Cleanroom Paul G Allen L107||
||Karl Suss Wafer Bonder Training|