Physical Vapor Deposition (PVD)

PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Equipment name & Badger ID	Location	Overview	Materials Lab Supplied	Link to Training
AJA Evaporator aja-evap	SNF Exfab Paul G Allen 155A Venice	The AJA e-beam evaporator can be used to directionally deposit...	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Alumina Titania	AJA Evaporation training
AJA2 Evaporator aja2-evap	SNF Cleanroom Paul G Allen L107	The AJA e-beam evaporator can be used to directionally deposit...	Ag Al Co Cr Ge Hf Nb Pd Pt Si Ta Ti V W Zr Moly	AJA2 Evaporator
Hummer V Sputter Coater hummer	SNF Exfab Paul G Allen L119 Año Nuevo	The Technics Hummer V is a manually controlled table top...		Hummer V Sputter Coater Training
Innotec Evaporator Innotec	SNF Cleanroom Paul G Allen L107	Innotec is an E-beam metal evaporation system, capable of depositing...	Ag Al Au Co Cr Cu Fe Ge In Ni Pd Si Ta Ti W Moly	Innotec Evaporator Training
Intlvac Evaporation Intlvac_evap	SNF Cleanroom Paul G Allen L107		Al Co Cr Ge Hf Nb Ni Pd Si Ta Ti V W Zr Moly	Intlvac Evaporation Training
KJL Evaporator KJL	SNSF Nanofabrication Spilker 006 Nanopatterning Cleanroom	We have a KJ Lesker e-gun/beam evaporator available in the...	Ag Al Au Cr Cu Ge Ni Pd Ti V Moly	KJL Training
Lesker Sputter lesker-sputter	SNF Exfab Paul G Allen 155A Venice	Lesker is a load locked single wafer metal sputter providing...	Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	Lesker Sputter Training
Lesker2 Sputter lesker2-sputter	SNF Cleanroom Paul G Allen L107	Lesker2 is a load locked single wafer metal sputter providing...	Ag Al AlSi Cr Ge Pd Ru Sc Si SiO₂ Sn Ta Ti TiN W Alumina ITO Moly	Lesker2 Sputter Training
Metalica Sputter metalica	SNF Cleanroom Paul G Allen L107	Metalica is a metal sputter that was built “in-house” to...	Ag Al Au Cr Cu NiCr Pd Pt Sn Ta Ti V W Moly Ti Tungsten	Metalica Sputter Training
MFS Large Evaporator MFS Large			Ag Al Au Cr Cu Fe Ge Ir MgF Nb Ni Pd SiO Ta Ti W Moly	MFS Large Training
MFS Small Evaporator MFS Small			Ag Al Au Cr Cu Fe Ge In Ni SiO Sn Ti	MFS Small Training
Oerlikon Leybold Sputter				Oerlikon Leybold Univex 400 RF/DC Sputter Station Training

Project

Controlled metal Deposition on Flexible Polyethylene Substrates by Sputtering for CO2 Reduction
Cuprite (Cu2O) Rydberg Excitons for Integration with Photonics
Develop Calibration Process for Innotec Tilt Angle Jig
Optimizing the Electrical Stability of Platinum Films Deposited in Lesker - Sputter
Physical and Electrical Characterization of RF-Sputtered ITO Films for Use as Solar Cell Electrodes as well as Interlayers in Low-Resistance MIS Contacts in Ge/Si Transistors
Procedure to Deposit Gold Only on the Sidewalls of Rectangular Nanostructures and Its Application
Sputtering Deposition of Metal and Dielectric Films
Superconducting Parallel Plate Capacitors with High Kinetic Inductance

Documentation

Cuprite (Cu2O) Rydberg Excitons for Integration with Photonics

We aim to develop a process to thermally oxidize Cu and reliably grow Cu2O for the purpose of photonics integration, and ultimately probe the promise of this platform for nonlinear and quantum optics experiments
Develop Calibration Process for Innotec Tilt Angle Jig- Final Report
Lesker2 Sputter TiN Initial Development

Our goal was to develop a process for sputtering of NVM-quality TiN using the new Lesker sputtering tool (Lesker-2) that resides inside the cleanroom. This tool can achieve the high-vacuum pressures necessary for TiN films with low levels of oxygen contamination.
Optimizing the Electrical Stability of Platinum Films Deposited in Lesker-Sputter- Final Presentation
Optimizing the Electrical Stability of Platinum Films Deposited in Lesker-Sputter- Final Report
Physical and Electrical Characterization of Sputtered ITO Films for Use as Solar Cell Electrodes as Well as Interlayers in Low- Resistance MIS Contacts in Ge/Si Transistors- Final Presentation
Procedure to deposit Gold only on the sidewalls of rectangular nanostructures and its applications- Final Report
SOP- Cuprite Growth

The SOP with details for Cuprite growth is documented here.
Sputtering Deposition of Metal and Dielectric Films- Final Report
Sputtering deposition of metals and dielectrics- Final Presentation

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Physical Vapor Deposition (PVD)

Project

Documentation