Skip to content Skip to navigation

Physical Vapor Deposition (PVD)

PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.

Subscribe to
Equipment name & Badger ID Location Image Overview Materials Lab Supplied Link to Training
AJA Evaporator
aja-evap
SNF Exfab Paul G Allen 155A Venice

The AJA e-beam evaporator can be used to directionally deposit...

AJA Evaporation training
AJA2 Evaporator
aja2-evap
SNF Cleanroom Paul G Allen L107

The AJA e-beam evaporator can be used to directionally deposit...

AJA2 Evaporator
Hummer V Sputter Coater
hummer
SNF Exfab Paul G Allen L119 Año Nuevo

The Technics Hummer V is a manually controlled table top...

Hummer V Sputter Coater Training
Innotec Evaporator
Innotec
SNF Cleanroom Paul G Allen L107

Innotec is an E-beam metal evaporation system, capable of depositing...

Innotec Evaporator Training
Intlvac Evaporation
Intlvac_evap
SNF Cleanroom Paul G Allen L107
Intlvac Evaporation Training
Lesker Sputter
lesker-sputter
SNF Exfab Paul G Allen 155A Venice
SNF-Lesker sputter

Lesker is a load locked single wafer metal sputter providing...

Lesker Sputter Training
Lesker2 Sputter
lesker2-sputter
SNF Cleanroom Paul G Allen L107
Lesker2-Sputter

Lesker2 is a load locked single wafer metal sputter providing...

Lesker2 Sputter Training

Project

Documentation