Resist Removal

There are many options available to remove resist from your substrate. Dry methods use plasma O2 to react with the resist, while wet methods use either solvents to dissolve the resist or oxidizing chemistries to react with the resist. For processes that are sensitive to resist residues, resist removal can consist of both a dry and a wet clean.

The cleaning method you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).

Technique Tabs

Main Tab

Processing Techniques	Equipment name & Badger ID	Teaser Blurb	Cleanliness	Location
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Gasonics Aura Asher gasonics	The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group.	Clean, Semiclean	SNF Cleanroom Paul G Allen L107
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Matrix Plasma Resist Strip matrix	The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen).	Flexible	SNF Cleanroom Paul G Allen L107
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal	Samco PC300 Plasma Etch System samco	The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch (similar to Drytek 2) or Downstream plasma modes	Flexible	SNF Cleanroom Paul G Allen L107
Dry Resist Removal, Dry Etching	Technics Asher technics	Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma	Flexible	SNF Cleanroom Paul G Allen L107
Piranha Cleaning, Wet Resist Removal	Wet Bench Clean_res-piranha wbclean_res-piranha	Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.	Clean	SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching	Wet Bench Flexcorr 1 wbflexcorr-1	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal, Metal Lift-off	Wet Bench Flexible Solvents wbflexsolv	Manual solvent cleaning of materials in the flexible cleanliness group.	Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal	Wet Bench Flexible Solvents 1 wbflexsolv-1	Manual solvent cleaning, two ultrasonic baths.	Flexible	SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal	Wet Bench Flexible Solvents 2 wbflexsolv-2	Manual solvent cleaning and resist removal, hot plate.	Flexible	SNF Cleanroom Paul G Allen L107
Wet Resist Removal	Wet Bench Resist Strip wbresstrip-1	Wet bench to remove resist using SRS-100 or PRS1000.	Clean (Ge), Semiclean, Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & Badger ID	Cleanliness	Chemicals	Primary Materials Etched	Other Materials Etched	Substrate Size	Maximum Load (number of wafers)	Process Temperature Range	Gases	Notes
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Gasonics Aura Asher gasonics	Clean, Semiclean		Resist	PI	4"	25		O₂	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching	Matrix Plasma Resist Strip matrix	Flexible		Resist	PI	4"	25		O₂	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal	Samco PC300 Plasma Etch System samco	Flexible		Resist	dimethylpolysiloxane Si Si3N4 SiO₂ SiON Various polymers PI	Pieces 2" 3" 4" 6" 8" Other	Four 4" wafers or two 6" wafers and one 8" wafer	20 ºC	CF₄ O₂ SF₆
Dry Resist Removal, Dry Etching	Technics Asher technics	Flexible		Resist	dimethylpolysiloxane poly(p-xylylene) PI	Pieces 4" 6" 8"	Four 4" wafers to pieces, one 6" or 8" wafer		O₂
Piranha Cleaning, Wet Resist Removal	Wet Bench Clean_res-piranha wbclean_res-piranha	Clean	9:1 Piranha			3" 4" 6"				Resist will be removed
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching	Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	Acids Bases Gold Etchant H₃PO₄ 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W	Pieces 2" 3" 4" 6"				Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Solvent Cleaning, Wet Resist Removal, Metal Lift-off	Wet Bench Flexible Solvents wbflexsolv	Flexible	Solvents			Pieces 2" 3" 4" 6"				Manual solvent cleaning of substrates or resist removal.
Solvent Cleaning, Wet Resist Removal	Wet Bench Flexible Solvents 1 wbflexsolv-1	Flexible	Solvents			Pieces 2" 3" 4" 6"				Manual solvent cleaning, two ultrasonic baths.
Solvent Cleaning, Wet Resist Removal	Wet Bench Flexible Solvents 2 wbflexsolv-2	Flexible	Solvents			Pieces 2" 3" 4" 6"				Manual solvent cleaning, hot plate
Wet Resist Removal	Wet Bench Resist Strip wbresstrip-1	Clean (Ge), Semiclean, Flexible	PRS-1000 SRS-100	Resist		Pieces 2" 3" 4"	25 4 inch wafers	20 °C - 60 °C		Wet Resist Removal: SRS-100 or PRS1000

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Techniques

Resist Removal

Technique Tabs