SNF is open under New Normal Rules. ANY shadowing must be coordinated with SNF staff first.
20:1 Buffered oxide etch
Preferred Short Name:
20:1 BOE
Chemical Formula:
38% NH4F, 2% HF, 60% H2O
Full Chemical Name (for In-Use Hazardous Chemicals card):
38% ammonium fluoride, 2% hydrofluoric acid, 60% water
BOE (Buffered Oxide Etch) is an HF based etchant, typically used to etch oxides. The buffer helps to reduce the impact to resist during etching.
| Equipment name & Badger ID | Training Required & Charges | Cleanliness | Location | Chemicals | Notes |
|---|---|---|---|---|---|
|
Wet Bench Clean_res-hf wbclean_res-hf |
Wet Bench Clean Piranha/HF/Phosphoric Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
Resist as mask allowed |
||
|
Wet Bench CMOS Metal (wbclean3) wbclean3 |
Wet Bench CMOS Metal (wbclean3) Training | SNF Cleanroom Paul G Allen L107 |
Al, Ti, or W wet etching or oxide etching |
||
|
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
