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Doping

Doping is a technique that introduces impurities into materials in order to change it's properties.

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Equipment name & Badger ID Cleanliness Cleaning Required Gases Substrate Size Process Temperature Range Maximum Load (number of wafers) Notes
Epi2
epi2
Clean Pre-Diffusion Clean
600 °C - 1200 °C
1

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

ThermcoLTO
thermcoLTO
Flexible
300 °C - 450 °C
26

limits on material vapor pressure

ThermcoPoly1
thermcopoly1
Clean Pre-Diffusion Clean
525 °C - 650 °C
44

Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.

ThermcoPoly2
thermcopoly2
Flexible Pre-Diffusion Clean
525 °C - 650 °C
44

Standard polysilicon deposition at 620C. P and N doping available.

TylanBPSG
tylanbpsg
Clean, Semiclean Pre-Diffusion Clean, Standard Metal Clean
300 °C - 450 °C
26