6:1 Buffered oxide etch
Preferred Short Name:
6:1 BOE
Chemical Formula:
34% NH4F, 7% HF, 59% H2O
Full Chemical Name (for In-Use Hazardous Chemicals card):
34% ammonium fluoride, 7% hydrofluoric acid, 59% water
BOE is an HF based etchant that is buffered to reduce impact to resist. This particular formulation is quite concentrated in HF and should only be used if needed. 20:1 BOE is a safer alternative for instances where there is not a lot of material to etch.
| Equipment name & Badger ID | Training Required & Charges | Cleanliness | Location | Chemicals | Notes |
|---|---|---|---|---|---|
|
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean 1 and 2 Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
||
|
Wet Bench Clean_res-hf wbclean_res-hf |
Wet Bench Clean Piranha/HF/Phosphoric Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
Resist as mask allowed |
||
|
Wet Bench CMOS Metal (wbclean3) wbclean3 |
Wet Bench CMOS Metal (wbclean3) Training | SNF Cleanroom Paul G Allen L107 |
Al, Ti, or W wet etching or oxide etching |
||
|
Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |
