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Silicon Germanium

Chemical Formula: 
SiGe
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Equipment name & Badger IDsort descending Training Required & Charges Cleanliness Location Notes
Lam Research TCP 9400 Poly Etcher
lampoly
Lam Research TCP 9400 Poly Etcher Training Clean, Semiclean SNF Cleanroom Paul G Allen L107

Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.

LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lithography Solvent Bench
lithosolv
Lithography Solvent Bench Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All SNF Exfab Paul G Allen 151 Ocean
Nanospec 210XP
nanospec2
Nanospec Training All SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Oven 110°C post-bake
oven110
Resist Postbake Oven 110°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Oven 90°C prebake
oven90
Resist Prebake Oven 90°C Training All SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

Oven BlueM 200°C to 430°C
bluem
Blue M Oven Training Flexible SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Profilometer Alphastep 500
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson
Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

RTA AllWin 610
aw610_r
AllWin 610 RTA Training Flexible SNF Cleanroom Paul G Allen L107
RTA AllWin 610
aw610_l
AllWin 610 RTA Training Clean SNF Cleanroom Paul G Allen L107

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Equipment name & Badger IDsort descending Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All 8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible ,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1.00 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
Lithography Solvent Bench
lithosolv
Flexible ,
,
,
,
,
,
,
,
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All ,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Nanospec 210XP
nanospec2
All ,
,
,
,
,
,
,
,
Oven (White)
white-oven
Flexible
0 °C - 200 °C
,
,
,
,
,
,
,
,
Oven 110°C post-bake
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
Oven 90°C prebake
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
PlasmaTherm Shuttlelock PECVD System
ccp-dep
All
100.00 Å - 4.00 μm
100 °C - 350 °C
,
,
,
,
,
,
,
,
4
Profilometer Alphastep 500
alphastep
Flexible ,
,
,
,
,
,
,
,
1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
,
,
,
,
,
,
,
,
,
,
,
1
Prometrix Resistivity Mapping System
prometrix
All ,
,
,
,
,
,
,
,
1
RTA AllWin 610
aw610_r
Flexible
21 °C - 1150 °C
,
,
RTA AllWin 610
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer

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