Wet Bench Clean_res- hotphos (wbclean_res-hotphos)

Overview

The wbclean_res-hotphos is part of the Wet Bench Clean_-res-piranha-hf-hotphos. This bench (semi-automated) is part of the Clean Equipment Group for 3", 4", and 6" Si, SiGe, and quartz substrates and can only be used for wet silicon nitride etching. Wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This part of the bench contains one hot pot for phosphoric acid and one automatic dump rinser.

Processing Technique(s)

Etching > Wet Etching > Silicon Nitride Wet Etching

Capabilities and Specifications

Primary Materials Etched

Chemicals

Substrate Type

Substrate Sizes

Notes:

Resist should have been removed

Lab Organization, Location, and NEMO Information

Lab Organization:

Stanford Nanofabrication Facility Cleanroom (SNF Cleanroom)

Location:

SNF Cleanroom Paul G Allen L107

NEMO Area:

SNF: Wet Benches

NEMO ID:

wbclean_res-hotphos

Training and Maintenance

Lab Facility:

SNF Cleanroom

Training Charges:

2.25 hours

Primary Trainer:

Backup Trainer(s):

Primary Maintenance:

Backup Maintenance:

Steps to become a tool user

Become a member of SNF.

Study the relevant operating procedures:
Wet Bench Clean Piranha

Wet Bench Clean Piranha: Remove resist using piranha Training Video
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
During the shadowing, use the Wet Bench Checklist.
Check the SNF Training Calendar for any scheduled training.
Contact the primary trainer: Uli Thumser