Wet Bench Clean_res-piranha (wbclean_res-piranha)
Overview
The wbclean_res-piranha is part of the Wet Bench Clean_-res-piranha-hf-hotphos. This bench (semi-automated) is part of the Clean Cleanliness Group for 3", 4", and 6" Si, SiGe, and quartz substrates and is primarily used for stripping photoresist, removing scribe dust and wet oxide etching. Wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This bench contains two hot pots for 90% sulfuric acid/hydrogen peroxide ("piranha") for stripping resist, two Teflon tanks containing 50:1 HF, 20:1 BOE, or 6:1 BOE for etching oxide, one hot pot for phosphoric acid, three automatic dump rinsers and two spin/rinse dryers.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Chemicals
Substrate Type
Substrate Sizes
Notes:
Resist will be removed
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Wet Benches
NEMO ID:
wbclean_res-piranha
Training and Maintenance
Lab Facility:
Training Charges:
2.25 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- During the shadowing, use the Wet Bench Checklist.
- Check the SNF Training Calendar for any scheduled training.
- Contact the primary trainer: Uli Thumser
Notes:
covered in wbclean-1 and-2
