About PPE: alcohol wipe down before and after each use. In addition, face shields will be placed in the steamer for 1 1/2 hours. Aprons will be user owned, not shared.
Wet Bench flexcorr-2 , part of Wet Bench wbflexcorr-1 and -2, is for wet chemical (corrosives) processing of standard (like silicon,quartz) and non-standard materials (like glass, gold, or metals), pieces, and wafers up to 6 inch for manual processing in beakers or labware. Processing includes but is not limited to wafer cleaning, etching of silicon, oxide etching using HF, metal etching such as aluminum, gold, or chrome. The cleanliness is determined by the labware. Wbflexcorr-1 provides one DI water sink, a separate drain for HF waste disposal, one hot plate for heating acids or bases in beakers. Wbflexcorr-2 provides two 6 inch quartz-lined hot pots for SNF standard cleans or etchants (such as piranha, SC1, SC2, KOH, or TMAH), one 4 inch quartz-lined hot pot for 90% sulfuric acid/hydrogen peroxide (piranha) clean, and one dump rinser. Gallium Arsenide [GaAs] and III-V compounds (indium, gallium, arsenic, aluminum and phosphide based) materials are allowed but only in personal labware, not in any of the hot pots or dump rinser. Consult staff for non-standard processing conditions (such as elevated temperatures, unusually extended process times, or mixing of chemicals), even if standard SNF etchants and chemicals are to be used.
Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only