Wet Bench Clean_res-hf (wbclean_res-hf)
New Normal Changes
About PPE: alcohol wipe down before and after each use. In addition, face shields will be placed in the steamer for 1 1/2 hours. Aprons will be user owned, not shared.
The wbclean-res-hf is part of the Wet Bench Clean_res-piranha,-hf, and -hotphos bench. This bench (semi-automated) is part of the Clean Equipment Group for 3", 4", and 6" Si, SiGe, and quartz substrates and is primarily used for stripping photoresist, removing scribe dust and wet oxide etching. Wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This station contains two hot pots for 90% sulfuric acid/hydrogen peroxide ("piranha") for stripping resist ,two Teflon tanks containing 50:1 HF, 20:1 BOE, or 6:1 BOE for etching oxide, one hot pot for phosphoric acid, three automatic dump rinsers and two spin/rinse dryers.
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists
. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form
and the Wet Bench Checklist
on clean room paper.
Sign up for the relevant training scheduled in
covered in wbclean-1 and-2