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Wet Bench Flexcorr 3 (wbflexcorr-3)

New Normal Changes

About PPE: alcohol wipe down before and after each use. In addition, face shields will be placed in the steamer for 1 1/2 hours. Aprons will be user owned, not shared.

Overview

This wet bench is used for wet chemical (corrosives) processing of standard and non-standard (flexible) materials like glass, wafer pieces, devices with gold or non-standard metals. It is also used for non-CMOS compatible processing, such as KOH etching. With the appropriate, dedicated glassware, KOH cleanup can be done to decontaminate wafers for later CMOS-compatible processing.

Cleanliness: 

Capabilities and Specifications

Process Temperature Range: 
Notes: 

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Lab Facility, Location, and Badger Information

Training and Maintenance

Lab Facility: 
Training Charges: 
2.25 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Read the relevant operating procedures:
  2. Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
    Print the SNF Training Shadowing Form on clean room paper.
  3. Sign up for the relevant training scheduled in .
  4. Contact the primary trainer: .

Operating Instructions