Wet Bench Clean 2 (wbclean-2)
The Wet Bench Clean-1 and 2 is used for cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers prior to processing in diffusion furnaces, LPCVD furnaces or before metal deposition. The cleans performed here are high quality, final cleans which precede high temperature processing. To be processed at this station, wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This station contains 2 sets of SC1 (5:1:1 H2O:H2O2:NH4OH) for removal of trace organics and SC2 (5:1:1 H2O:H2O2:HCl) for removal of trace metal ions, HF tanks (50:1 HF, and 6:1 BOE) for oxide etching in addition to dump rinse and spin-rinse-dry modules.
Capabilities and Specifications
Process Temperature Range:
No resist allowed. Resist should have been removed at the wbclean_res-piranha
Lab Facility, Location, and Badger Information
Training and Maintenance
Steps to become a tool user
Read the relevant operating procedures:
Read all additional material on the SNF website concerning this tool Wet Bench Operating Instructions for WAFAB
, and Additional Process Info
Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the . We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Follow the instructions on this form: SNF Training Shadowing Form
and this checklist: Wet Bench Checklist