Acids

Acids are used typically to etch or clean substrates.

List of Acids

20:1 Buffered oxide etch aka "20:1 BOE" (38% NH₄F, 2% HF, 60% H₂O)

50:1 Hydrofluoric Acid aka "50:1 HF" (50:1 HF)

6:1 Buffered oxide etch aka "6:1 BOE" (34% NH₄F, 7% HF, 59% H₂O)

9:1 Piranha Solution aka "9:1 Piranha" (9:1 H₂SO₄:H₂O₂)

Standard Clean 1 aka "SC1" (5:1:1 H₂O:H₂O₂:NH₄OH)

Standard Clean 2 aka "SC2" (H₂O:H₂O₂:HCl (5:1:1))

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Location	Chemicals	Notes
Wet Bench Flexcorr 1 wbflexcorr-1	Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours	Flexible	SNF Cleanroom Paul G Allen L107	Acids Bases Gold Etchant H₃PO₄ 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Wet Bench Flexcorr 2 wbflexcorr-2	Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours	Flexible	SNF Cleanroom Paul G Allen L107	Acids Bases	Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only
Wet Bench Flexcorr 3 wbflexcorr-3	Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours	Flexible	SNF Cleanroom Paul G Allen L107	Acids Bases	Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.
Wet Bench Flexcorr 4 wbflexcorr-4	Wet Bench Flexcorr 1and2 and 3and4 Training 2.25 hours	Flexible	SNF Cleanroom Paul G Allen L107	Acids Bases	Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.