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4 inch wafer

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4"
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Equipment name & Badger IDsort descending Training Required & Charges Cleanliness Lab Organization Location Notes
110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Aix200
aix200
Aixtron MOCVD - III-V system training Flexible
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Aixtron Black Magic graphene CVD furnace training Flexible
SNF
SNF Exfab Paul G Allen L119 Año Nuevo
AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All
SNF
SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

Aw610_l
aw610_l
AllWin 610 RTA Training Clean
SNF
SNF Cleanroom Paul G Allen L107
Aw610_r
aw610_r
AllWin 610 RTA Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Epi2
epi2
AMAT Centurion Epitaxial Training Clean
SNF
SNF Cleanroom Paul G Allen L107

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All
SNF
SNF Cleanroom Paul G Allen L107

Spray coating of resists

Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson

Pages

Equipment name & Badger IDsort descending Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
Aix200
aix200
Pre-Diffusion Clean, Special: See Notes Flexible
0 - 5 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Aw610_l
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer
Aw610_r
aw610_r
Flexible
21 °C - 1150 °C
,
,
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Epi2
epi2
Pre-Diffusion Clean Clean
50 Å - 3 μm
600 °C - 1200 °C
1
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch
,
,
,
,
one piece or wafer
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All
,
,
,
,
1
Ex Fab Develop Wet Bench
wbexfab_dev
Flexible
Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible

Pages