The "Semiclean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Semiclean" category.
Equipment name & Badger ID![]() |
Technique | Cleaning Required | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Objective Separation | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AJA2 Evaporator aja2-evap |
Semiclean |
0 -
300 nm
|
|
|
|
, , , , , |
4"x3 or 6"x1 wafers or pieces | ||||||||
AMAT P5000 Etcher p5000etch |
Clean, Clean (Ge), Semiclean |
|
|
|
|
||||||||||
Fiji 1 ALD fiji1 |
Semiclean |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , |
|||||||||
Gasonics Aura Asher gasonics |
Clean, Semiclean |
|
|
|
|
25 | |||||||||
Intlvac Evaporation Intlvac_evap |
Clean, Semiclean |
0 -
1 μm
|
|
|
|
, , |
12 4 inch wafers, 2 6 inch wafers | ||||||||
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
|
|
|
|
, |
25 | ||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1 μm
|
|
|
°C - 800 °C
|
, , , , , , , , , |
one 4 inch wafer, one 6 inch wafer | ||||||||
STS Deep RIE Etcher stsetch |
Clean, Semiclean |
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|
|
|
1 | |||||||||
Tencor P2 Profilometer p2 |
Clean, Semiclean |
|
|
|
|
, , , , , , , , |
1 | ||||||||
TylanBPSG tylanbpsg |
Pre-Diffusion Clean, Standard Metal Clean | Clean, Semiclean |
100 Å -
3 μm
|
|
|
300 °C - 450 °C
|
, , |
26 | |||||||
Tylanfga Forming Gas Anneal Furnace tylanfga |
Standard Metal Clean | Semiclean |
100 Å -
100 Å
|
|
|
250 °C - 800 °C
|
50 | ||||||||
Wet Bench CMOS Metal (wbclean3) wbclean3 |
Semiclean |
|
|
|
|
, , |
25 wafers | ||||||||
Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
|
|
|
20 °C - 60 °C
|
, , , , , , |
25 4 inch wafers |