Skip to content Skip to navigation

4 inch wafer

Short Name: 
4"
Subscribe to
Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
ThermcoNitride
thermconitride1
Thermco Nitride Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Stociometric and low stress (~150mPa) programs available

ThermcoPoly2
thermcopoly2
Thermco Poly Deposition Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available.

ThermcoPoly1
thermcopoly1
Thermco Poly Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.

ThermcoLTO
thermcoLTO
Thermco LTO Deposition Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

limits on material vapor pressure

Teos2
teos2
Teos Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Very conformal.

TylanBPSG
tylanbpsg
TylanBPSG Deposition Furnace Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Innotec Evaporator
Innotec
Innotec Evaporator Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Precious metals limit is <200nm

Intlvac Evaporation
Intlvac_evap
Intlvac Evaporation Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107
EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Sensofar S-neox
s-neox
Sensofar S-neox Training All
SNF
SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

Flexus 2320 Stress Tester
stresstest
Flexus 2320 Stress Tester Training All
SNF
SNF Cleanroom Paul G Allen L107
White Oven
white-oven
White Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Ebeam Process Wet Bench
wbebres
Ebeam Process Wet Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual developing of Ebeam resist

PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All
SNF
SNF Cleanroom Paul G Allen L107

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Thermolyne
thermolyne
Thermolyne Muffle Furnace Training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Heidelberg MLA 150
heidelberg
Heidelberg Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All
SNF
SNF Cleanroom Paul G Allen L107

Direct Write

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Keyence Digital Microscope VHX-6000
keyence
Keyence Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
ThermcoNitride
thermconitride1
Pre-Diffusion Clean Clean
100 Å - 2 μm
785 °C - 850 °C
44
ThermcoPoly1
thermcopoly1
Pre-Diffusion Clean Clean
100 Å - 3 μm
525 °C - 650 °C
,
,
44
ThermcoPoly2
thermcopoly2
Pre-Diffusion Clean Flexible
100 Å - 3 μm
525 °C - 650 °C
44
Thermolyne
thermolyne
Flexible
25 °C - 1000 °C
25
Tylan9
tylan9
Flexible
250 °C - 1100 °C
,
,
50
TylanBPSG
tylanbpsg
Pre-Diffusion Clean, Standard Metal Clean Clean, Semiclean
100 Å - 3 μm
300 °C - 450 °C
,
,
26
Tylanfga
tylanfga
Standard Metal Clean Semiclean
100 Å - 100 Å
250 °C - 800 °C
50
Wet Bench Clean 1
wbclean-1
Clean
,
,
25
Wet Bench Clean 2
wbclean-2
Clean
,
,
25
Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Clean
,
,
Wet Bench Clean_res-hf
wbclean_res-hf
Clean
,
,
Wet Bench Clean_res-piranha
wbclean_res-piranha
Clean
,
,
Wet Bench CMOS Metal (wbclean3)
wbclean3
Semiclean
,
,
25 wafers
Wet Bench Decontamination
wbdecon
Clean
,
,
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 4
wbflexcorr-4
Flexible
Wet Bench Flexible Solvents
wbflexsolv
Flexible
,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible
,
,
,
,
,
,
,
,
,
,

Pages