Equipment name & Badger ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Objective Separation | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EV Group Wafer Bonder evbond |
Flexible |
|
|
|
|
, , , , , |
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Fiji 2 fiji2 |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 350 °C
|
, , , , , , , , , , , , |
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Heidelberg MLA 150 heidelberg |
All |
|
|
405 nm |
|
|
, , , , , , , , , , , , |
1 | ||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
|
|
375 nm |
|
|
, , , , , , , , , , , , |
1 | ||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
|
|
|
|
, , , , , , , , , , , |
1x4" wafer | |||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
|
|
|
|
, , , , , , , , , , , , |
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Samco PC300 Plasma Etch System samco |
Flexible |
|
|
|
20 ºC
|
, , , , , , , , , , , , , |
Four 4" wafers or two 6" wafers and one 8" wafer | |||||||
Savannah savannah |
Flexible |
1 Å -
50 nm
|
|
|
24 °C - 250 °C
|
, , , , , , , , , , , , |
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Woollam woollam |
All |
|
|
|
|
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1 |