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Gallium Nitride

Chemical Formula: 
GaN
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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Fiji 2
fiji2
Fiji 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Flexus 2320 Stress Tester
stresstest
Flexus 2320 Stress Tester Training All
SNF
SNF Cleanroom Paul G Allen L107
Headway Manual Resist Spinner
headway2
Headway Manual Resist Spinner Training All
SNF
SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Heidelberg MLA 150
heidelberg
Heidelberg Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All
SNF
SNF Cleanroom Paul G Allen L107

Direct Write

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Karl Suss MA-6 Contact Aligner 1
karlsuss
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align, including IR.

Karl Suss MA-6 Contact Aligner 2
karlsuss2
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align.

Keyence Digital Microscope VHX-6000
keyence
Keyence Training All
SNF
SNF Exfab Paul G Allen 104 Stinson
Lakeshore Hall Measurement System
LakeshoreHall
Lakeshore Hall Measurement System training All
SNF
SNF Exfab Paul G Allen 151 Ocean
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
Lesker Sputter
lesker-sputter
Lesker Sputter Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Flexus 2320 Stress Tester
stresstest
All
,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner 1
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner 2
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All
,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
All
100 μm - 1000 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer

Pages