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3 inch wafer

Short Name: 
3"

The following is a list of equipment where 3 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort ascending Notes
Wet Bench Clean 2
wbclean-2
Wet Bench Clean1and2 Training Clean SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

EVG Contact Aligner
evalign
Contact Aligner EVG Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Thermco3 Oxidation Furnace
thermco 3
Thermco 3 Oxidation Furnaces Training Clean SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

Nanospec 3
nanospec3
Nanospec 3 Training All SNF Cleanroom Paul G Allen L107
Headway 3 Manual Resist Spinner
headway3
Resist Coat (manual) Headway 3 Training All SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Nanospec 210XP
nanospec2
Nanospec Training All SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Profilometer Alphastep 500
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Wet Bench Clean_res-hf
wbclean_res-hf
Clean
,
,
Wet Bench Clean_res-piranha
wbclean_res-piranha
Clean
,
,
Wet Bench CMOS Metal
wbclean3
Semiclean
,
,
25 wafers
Wet Bench Decontamination
wbdecon
Clean
,
,
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 4
wbflexcorr-4
Flexible
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Miscellaneous
wbmiscres
Flexible ,
,
,
,
,
,
,
,
Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
,
,
,
,
,
25 4 inch wafers
Wet Bench Solvent Lithography
lithosolv
Flexible ,
,
,
,
,
,
,
,
Woollam
woollam
All ,
,
,
,
,
,
,
,
,
,
,
,
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1
Xactix Xenon Difluoride Etcher
xactix
All ,
,
,
,
,
,
,
,
,
1

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